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>> Industry Abbreviations
Look through 366 acronyms and abbreviations related to Industry:
LAN
— Local Area Network
URL
— Universal Resource Locator
ROM
— Read-Only Memory
FTP
— File Transfer Protocol
ANSI
— American National Standards Institute, Inc.
ANOVA
— Analysis of Variance (statistics)
LED
— Light-Emitting Diode
OEM
— Original Equipment Manufacturer (usually in reference to car parts)
RSS
— Ramp Soak Spike
PPM
— parts per million
ROM
— Rough Order of Magnitude
CPU
— Central Processing Unit
EPA
— Environmental Protection Agency (US)
PID
— Photo-Imageable Dielectric
RFP
— Request For Proposal
BT
— Bismaleimide Triazine
IP
— Internet Protocol
ISO
— International Organization for Standardization
ASTM
— American Society for Testing and Materials (Philadelphia, Pennsylvania)
P&IA
— Packaging And Interconnecting Assembly
EDI
— Electronic Data Interchange
MSDS
— Material Safety Data Sheets
LCD
— Liquid Crystal Display
FET
— Field Effect Transistor
DSC
— Differential Scanning Calorimetry
AC
— Alternating Current
P&IS
— Packaging And Interconnecting Structure
TQM
— Total Quality Management
WWW
— World Wide Web
ASCII
— American National Standard Code for Information Interchange
MTBF
— Mean Time Before Failure
ASME
— American Society of Mechanical Engineers
SMOBC
— Solder Mask Over Bare Copper
HTTP
— Hypertext Transfer Protocol
RPM
— Revolutions Per Minute, (Rotations Per Minute)
PCB
— printed circuit board
NPI
— New Product Introduction
DBMS
— Database Management System
CAE
— Computer-Aided Engineering
DOD
— United States Department of Defense
RAM
— random-access memory
CFM
— Cubic Feet per Minute
CRT
— Cathode Ray Tube (type of TV)
FAA
— Federal Aviation Administration
ECR
— Engineering Change Request
ENIPIG
— Electroless Nickel Immersion Palladium Immersion Gold
RFS
— Regardless of Feature Size
BOD
— Biochemical Oxygen Demand
MMIC
— Monolithic Microwave Integrated Circuit
MTTR
— Mean Time To Repair
AGC
— Automatic Gain Control
ABS
— Acrylonitrile, Butadiene, and Styrene
NC
— Numerical Control
WIP
— Work in Process
ECO
— Engineering Change Order
EMP
— Electromagnetic Pulse
FFT
— Fast Fourier Transform
PC
— Personal computer (host)
TTL
— Transistor-Transistor Logic
DC
— Direct Current
AQL
— Acceptable Quality Level
MAP
— Manufacturing Automation Protocol
BOM
— Bill of Material
RPM
— Resale Price Maintenance. The UK Net Book Agreement, as was. Means by which retail prices are controlled by primary suppliers. (Alternatively, Revolutions Per Minute, as in engine speed and 78, 33 and 45 records. In years to come how many people will know
ECN
— Engineering Change Notice
ATR
— Air Transport Rack
WYSIWYG
— What You See Is What You Get (pronounced Wizzy-wig. See Entry For Derived Acronyms)
SQL
— Structured Query Language
PVC
— Polyvinyl Chloride
IC
— Integrated Circuit
PSI
— Pounds Per Square Inch (Static Pressure)
FCC
— Federal Communications Commission (US)
RFQ
— Request For Quote
FC-PBGA
— Flip Chip Platic Ball Grid Array
I/O
— Input/Output
NEMA
— National Electric Manufacturer's Association
ECC
— Error Correction Code (Error Checking And Correction)
NSA
— National Security Agency
AWG
— American Wire Gauge
DLA
— U.S. Defense Logistics Agency
SPC
— Statistical Process Control. Forerunning quality theory from the 1960s to TQC and TQM.
CRC
— Contrôle de Redondance Cyclique (French: Cyclic Redundancy Check)
AEC
— Architecture, Engineering, Construction
OSI
— Open Systems Interconnection (iso Standard)
ESD
— Electrostatic Discharge
PLD
— Programmable Logic Device
SAE
— Society of Automotive Engineers
IEEE
— Institute of Electrical and Electronic Engineers, Inc.
T&C
— Terms & Conditions
DOE
— Design Of Experiment
PDL
— Page Description Language
PLCC
— Plastic Leaded Chip Carrier (electronics)
PBX
— Private Branch eXchange (company phone system)
DMA
— direct memory access (computer term)
BITE
— Built-In Test Equipment
CNC
— Computer Numerical Control
SFM
— Surface Feet per Minute
IR
— Infrared
MRP II
— manufacturing resource planning
MOS
— Model Output Statistics
SQC
— Statistical Quality Control
RMS
— root mean square (preferred over "RMS")
NBS
— National Bureau of Standards (US)
IEC
— International Electrotechnical Commission
DSP
— Digital Signal Processor
EMC
— Electromagnetic Compatibility
PGA
— Pin Grid Array
ASQ
— Alpha System Qualification
CSP
— Chip Scale Package
CTE
— Coefficient of Thermal Expansion
MAC
— Media Access Control
CAGE
— Commercial and Government Entity
C&E
— Cause and Effect
CAD
— Computer-Aided Design
MSI
— Medium-Scale Integration
PCMCIA
— Personal Computer Memory Card International Association
VOC
— Volatile Organic Compounds (air pollution)
DRC
— Design Rule Check
QPL
— qualified products list
BGA
— Ball Grid Array [electronic Packaging]
ARINC
— Aeronautical Radio Incorporated
NDT
— Nondestructive Test
NASA
— National Aeronautics and Space Administration (US)
PPS
— Polyphenylene Sulfide
MMC
— Maximum Material Condition
MDA
— Methylenedianiline
ENIG
— Electroless Nickel Immersion Gold
TCR
— Temperature Coefficient of Resistance
OLB
— Outer-Lead Bonding
JIT
— Just-In-Time (inventory management)
UBM
— Under Bump Metallization
FC-CBGA
— Flip Chip Ceramic Ball Grid Array
FPGA
— Field-Programmable Gate Array
TFE
— Tetrafluoroethylene
DVM
— Digital Voltmeter
PTFE
— Polytetrafluoroethylene
LRU
— Lowest Replaceable Unit
RISC
— Reduced Instruction Set Computing
DCMA
— Defense Contract Management Agency
LSI
— Large Scale Integration -> VLSI
LBA
— Logical Block Addresses
CDA
— Copper Development Association Inc.
MRP
— Material Requirement Planning
TIFF
— Tag Image File Format
AOQ
— Average Outgoing Quality
EIA
— Electronics Industry Association (Adelaide, South Australia, Australia)
IPM
— Inches Per Minute
PCA
— Printed Circuit Assembly
UPH
— Unit Per Hour
TP
— True Position
EDO
— Extended Data Output
SERA
— Sequential Electrochemical Reduction Analysis
MITI
— Ministry of International Trade and Industry
CAM
— Computer-Aided Manufacturing
ESI
— Early Supplier Involvement
KGB
— Known Good Board
CPLD
— Complex Programmable Logic Device
DXF
— Data Exchange Format
TDR
— Time-Domain Reflectometry
TG
— Glass Transition Temperature
ENEPIG
— Electroless Nickel Electroless Palladium Immersion Gold
CASE
— Computer-Aided Software Engineering
PIP
— Pin-In-Paste Technology
DCAS
— Defense Contract Administration Services
CITIS
— Contractor Integrated Technical Information Service
LCCC
— Leadless Ceramic Chip Carrier
SEM
— Scanning Electron Microscopes
ESR
— Equivalent Series Resistance
KGD
— Known Good Die
SMEMA
— Surface Mount Equipment Manufacturers Association
TCE
— Thermal Coefficient of Expansion
SIR
— Surface Insulation Resistance
EDIF
— Electronic Design Interchange Format
UHF
— Ultrahigh Frequency
EDA
— Electronic Design Automation
MAC
— Maximum Allowable Concentration
CISC
— Complex Instruction Set Computing
GMA
— Gas Metal Arc
FEP
— fluorinated ethylene-propylene
GTA
— Gas Tungsten Arc
PVT
— Production Validation Test
RTV
— Room Temperature Vulcanizer
LPISM
— Liquid Photo-Imageable Solder Mask
DTS
— Dock to Stock
LIF
— Low Insertion Force
TOP
— Technical And Office Protocol
DESC
— Defense Electronics Supply Center
CET
— Certified Electronic Technician
ILB
— Inner-Lead Bonding
SSI
— Small-Scale Integration
CALS
— Computer-aided Acquisition and Logistic Support
MA
— Mechanical Advantage
SPICE
— Simulation Program Integrated Circuit Emphasis
CAT
— Computer-Aided Testing
PPO
— PolyPhenylene Oxide
DK
— Dielectric Constant
APT
— Automatically Programmed Tools
VAR
— Value-Added Reseller
FAR
— Failure Analysis Report
SMD
— Surface Mount Device
MEK
— Methylethyl Ketone
ICAM
— integrated computer-aided manufacturing
MCAE
— Mechanical Computer-Aided Engineering
PB
— Printed Board
CBGA
— Ceramic Ball Grid Array
EIS
— Engineering Information System
DNC
— Distributed Numerical Control
MLB
— Multilayer Board
FSCM
— Federal Stock Code for Manufacturers
DOD
— Dissolved Oxygen Demand
CFM
— Continuous Flow Manufacturing
ED
— Electrodeposited
CMC
— Copper Moly Copper
EMF
— Electro-Motive Force
ZIP
— zigzag inline package
ZAF
— Z-Axis Adhesive Film
SEM
— standard electronic module
PBGA
— Plastic Ball Grid Array
VHF
— Very-High Frequency
AXI
— Automated X-Ray Inspection
AGV
— Automated Guided Vehicle
CCAPS
— Circuit Card Assembly And Processing System
SIP
— Single Inline Package
ECAD
— Electronic Computer-Aided Design
EMS
— Electrical Manufacturing Services
QTA
— Quick Turn Around
ACCU
— Alternating Current Connection Unit
CAFM
— Computer-Aided Facilities Management
AA
— Antenna Array
PDES
— Product Data Exchange Specification
DCMC
— Defense Contract Management Command
AVT
— Accelerated Vesication Test
PWA
— Printed Wiring Assembly
RETMA
— Radio Electronics & Television Manufacturers Association
THT
— Through-Hole Technology
GAAS
— Gallium Arsenide Application Symposium
SMTA
— Surface Mount Technology Association
DTP
— Diameter True Position
ISHM
— International Society For Hybrid Microelectronics
XIP
— Execute In Place
CVS
— Cyclic Voltammetry Stripping
DIP
— Dual-Inline Package
ZIF
— Zero-Insertion Force
MELF
— Metal Electrode Face
NBR
— Nitrile Butadiene-Acrylonitrile Rubber
SOIC
— Small-Outline Integrated Circuit
ACA
— Anisotropically Conductive Adhesive
AGR
— Annual Average Growth Rate
FMEA
— Fault Mode And Effect Analysis
LGA
— Lang Grid Array
COD
— Consumed Oxygen Demand
QFP
— Quad Flatpack Package
DRM
— Drawing Requirements Manual
R&R
— Repeatability and Reproducibility
VHDL
— Vhsic Hardware Description Language
ETPC
— Electrolytic Tough-Pitch Copper
IEDR
— Initial Engineering Design Review
QML
— Qualified Manufacturer's List
CAPP
— Computer-Aided Process Planning
GTPBGA
— Glob Top Plastic Ball Grid Array
DMS
— Dynamic Mechanical Spectroscopy
AIS
— Adhesive Interconnect System
EMPF
— Electronics Manufacturing Productivity Facility
CPU
— Capability Performance Upper
CMOS
— cargo movement operations system; complimentary metal-oxide semiconductor
ITT
— Inter-Test Time
ASPARC
— Ability of Solder Paste to Retain Components
BDMA
— Benzyldimethylamine
IEPS
— International Electronic Packaging Society
PRT
— Planar Resistor Technology
HPGL
— Hewlett Packard Graphic Language
DATC
— Design Automation Technical Committee (IEEE)
ELD
— Electro-Luminescent Diode
ISCET
— International Society of Certified Electronics Technicians
COB
— Chip-On-Board
BC
— Buried Capacitance
VHSIC
— Very-High Speed Integrated Circuits
VLSI
— Very-Large Scale Integration
LMC
— Least Material Condition
TO
— Transistor Outline
C4
— Controlled Collapse Component Connection
OFHC
— Oxygen-Free High-Conductivity Copper
ECCB
— Electronic Components Certification Board
GBIB
— General Purpose Interface Bus
DMSA
— Defense Manufacturers And Suppliers Association
SMT
— Surface Mounting Technology
ODR
— Oscillating Disk Rheometer
TGA
— Thermo Gravimetric Analysis
HTE
— High Temperature Elongation
DAB
— Designated Audit Body
AOI
— Automated Optical Inspection
STEP
— Standard For Exchange Of Product Model Data
FPT
— Fine-Pitch Technology
TFA
— Tree-Based Floorplanning Algorithm
C3
— Command,Control And Communicate
DFM
— Design For Manufacture
FEA
— Finite-Element Analysis
FEM
— Finite-Element Modeling
TMA
— Thermo Mechanical Analysis
AA
— Automatic Acknowledge
NADCAP
— National Aerospace and Defense Contractors Accreditation Procedures
RA
— Rosin-Activated
OA
— Organic Acid
ECL
— Emitter-Coupled Logic
OSP
— Organic Solder Preservative
NECQ
— National Electronics Component Qualification System
FCC
— Flat-Conductor Cable
NIST
— National Institute For Science And Technology
VME
— Versa-Module Electronic
COT
— Configure To Order
HASL
— Hot Air Solder Leveler
SOS
— Silicon-On-Sapphire
CSA
— Canadian Standards Agency
ATG
— Automatic Test Generation
LTCC
— Low Temperature Co-fired Ceramic
CAR
— Computer-Aided Repair
RWOH
— Reliability Without Hermeticity
RFI
— Radio-Frequency Interference
CAF
— Cathotic Anionic Filaments
MCAD
— Mechanical Computer Aided Design
VSAG
— Vhdl Standardization and Analysis Group
IGES
— Integrated Graphics Exchange System
RMA
— Rosin Mildy Activated
TAB
— Tape-Automated Bonding
PHIGS
— Programmer's Hierarchical Interface Graphics Standard
FCT
— Functional Circuit Test
PTH
— Plated-Through Hole
R
— Rosin
EPT
— Ethylene-Propylene Terepolymer
WSI
— Wafer-Scale Integration
MIBK
— Methyl-Isobutyl Ketone
IECQ
— International Electronic Component Qualification System
MLPWB
— Multilayer Printed Wiring Board
DIN
— Deutsches Institute for Normung
CP
— Capability Performance
BTAB
— Bumped Tape-Automated Bonding
PT
— Positional tolerance
DOS
— Disc Operating System
BOT
— Build To Order
MCM
— multichip module
CEPM
— Certified Ems Program Managers
DIM
— Data-Information Record
AC
— All Call
NMR
— Normal-Mode Rejection
MATS
— Material Transport Segment
SBU
— Sequential Buildup
IDC
— Insulation-Displacement Connection
ULSI
— Ultra-Large Scale Integration
CPL
— Capability Performance, Lower
LDA
— Logic Design Automation
CSG
— Constructive Solids Geometry
EDM
— Electro-Discharge Machining
CIM
— computer-integrated manufacturing
PP
— Process Performance
DS
— Double-Sided
SEC
— Solvent Extract Conductivity
JEDEC
— Solid State Technology Association
ICA
— Isotropically Conductive Adhesive
ACC
— Advanced Concept Construction Active Control Channel
ICT
— Inner Circuit Test
CM
— Contract Manufacturer
MIR
— Moisture Insulation Resistance
OSHA
— Occupational Safety Hazards Act
PEM
— Plastic Electronic Module
EPR
— Ethylene-propylene Resin
RTS
— Ramp To Spike
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