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>> Industry Abbreviations
Look through 366 acronyms and abbreviations related to Industry:
LAN
— Local Area Network
ANOVA
— Analysis of Variance (statistics)
ROM
— Read-Only Memory
FTP
— File Transfer Protocol
BT
— Bismaleimide Triazine
DSC
— Differential Scanning Calorimetry
CPU
— Central Processing Unit
ANSI
— American National Standards Institute, Inc.
LED
— Light-Emitting Diode
WWW
— World Wide Web
OEM
— Original Equipment Manufacturer (usually in reference to car parts)
PID
— Photo-Imageable Dielectric
ISO
— International Organization for Standardization
LCD
— Liquid Crystal Display
IP
— Internet Protocol
EDI
— Electronic Data Interchange
RSS
— Ramp Soak Spike
FET
— Field Effect Transistor
AC
— Alternating Current
DBMS
— Database Management System
BOD
— Biochemical Oxygen Demand
ABS
— Acrylonitrile, Butadiene, and Styrene
RFP
— Request For Proposal
HTTP
— Hypertext Transfer Protocol
TQM
— Total Quality Management
SMOBC
— Solder Mask Over Bare Copper
RFS
— Regardless of Feature Size
PPM
— parts per million
ASME
— American Society of Mechanical Engineers
MMIC
— Monolithic Microwave Integrated Circuit
EMP
— Electromagnetic Pulse
ATR
— Air Transport Rack
ENIPIG
— Electroless Nickel Immersion Palladium Immersion Gold
MSDS
— Material Safety Data Sheets
ROM
— Rough Order of Magnitude
CAE
— Computer-Aided Engineering
ASTM
— American Society for Testing and Materials (Philadelphia, Pennsylvania)
PCB
— printed circuit board
NPI
— New Product Introduction
FAA
— Federal Aviation Administration
NC
— Numerical Control
MTBF
— Mean Time Before Failure
EPA
— Environmental Protection Agency (US)
I/O
— Input/Output
ASCII
— American National Standard Code for Information Interchange
TTL
— Transistor-Transistor Logic
RAM
— random-access memory
URL
— Universal Resource Locator
IC
— Integrated Circuit
PDL
— Page Description Language
FFT
— Fast Fourier Transform
MOS
— Model Output Statistics
PLD
— Programmable Logic Device
PVC
— Polyvinyl Chloride
CTE
— Coefficient of Thermal Expansion
CFM
— Cubic Feet per Minute
AGC
— Automatic Gain Control
DC
— Direct Current
PGA
— Pin Grid Array
CRT
— Cathode Ray Tube (type of TV)
OSI
— Open Systems Interconnection (iso Standard)
RFQ
— Request For Quote
NSA
— National Security Agency
P&IA
— Packaging And Interconnecting Assembly
BOM
— Bill of Material
DOD
— United States Department of Defense
CSP
— Chip Scale Package
ECR
— Engineering Change Request
MTTR
— Mean Time To Repair
BITE
— Built-In Test Equipment
FC-PBGA
— Flip Chip Platic Ball Grid Array
MAP
— Manufacturing Automation Protocol
RPM
— Revolutions Per Minute, (Rotations Per Minute)
DMA
— direct memory access (computer term)
SQL
— Structured Query Language
AQL
— Acceptable Quality Level
ECO
— Engineering Change Order
IEC
— International Electrotechnical Commission
PC
— Personal computer (host)
IR
— Infrared
ESD
— Electrostatic Discharge
AEC
— Architecture, Engineering, Construction
WYSIWYG
— What You See Is What You Get (pronounced Wizzy-wig. See Entry For Derived Acronyms)
ECC
— Error Correction Code (Error Checking And Correction)
PLCC
— Plastic Leaded Chip Carrier (electronics)
MAC
— Media Access Control
DRC
— Design Rule Check
EMC
— Electromagnetic Compatibility
P&IS
— Packaging And Interconnecting Structure
MMC
— Maximum Material Condition
CRC
— Contrôle de Redondance Cyclique (French: Cyclic Redundancy Check)
DOE
— Design Of Experiment
PSI
— Pounds Per Square Inch (Static Pressure)
WIP
— Work in Process
PBX
— Private Branch eXchange (company phone system)
FCC
— Federal Communications Commission (US)
IEEE
— Institute of Electrical and Electronic Engineers, Inc.
SAE
— Society of Automotive Engineers
DLA
— U.S. Defense Logistics Agency
NEMA
— National Electric Manufacturer's Association
DSP
— Digital Signal Processor
PPS
— Polyphenylene Sulfide
BGA
— Ball Grid Array [electronic Packaging]
NBS
— National Bureau of Standards (US)
LRU
— Lowest Replaceable Unit
RPM
— Resale Price Maintenance. The UK Net Book Agreement, as was. Means by which retail prices are controlled by primary suppliers. (Alternatively, Revolutions Per Minute, as in engine speed and 78, 33 and 45 records. In years to come how many people will know
ARINC
— Aeronautical Radio Incorporated
TFE
— Tetrafluoroethylene
TCR
— Temperature Coefficient of Resistance
ECN
— Engineering Change Notice
MSI
— Medium-Scale Integration
SFM
— Surface Feet per Minute
CDA
— Copper Development Association Inc.
CNC
— Computer Numerical Control
AWG
— American Wire Gauge
NASA
— National Aeronautics and Space Administration (US)
FC-CBGA
— Flip Chip Ceramic Ball Grid Array
RMS
— root mean square (preferred over "RMS")
CAD
— Computer-Aided Design
FPGA
— Field-Programmable Gate Array
ENIG
— Electroless Nickel Immersion Gold
TCE
— Thermal Coefficient of Expansion
MDA
— Methylenedianiline
T&C
— Terms & Conditions
VOC
— Volatile Organic Compounds (air pollution)
SIR
— Surface Insulation Resistance
DVM
— Digital Voltmeter
IPM
— Inches Per Minute
DCMA
— Defense Contract Management Agency
LBA
— Logical Block Addresses
JIT
— Just-In-Time (inventory management)
TP
— True Position
PCMCIA
— Personal Computer Memory Card International Association
C&E
— Cause and Effect
SMEMA
— Surface Mount Equipment Manufacturers Association
ESR
— Equivalent Series Resistance
PCA
— Printed Circuit Assembly
SQC
— Statistical Quality Control
NDT
— Nondestructive Test
AOQ
— Average Outgoing Quality
ASQ
— Alpha System Qualification
SPC
— Statistical Process Control. Forerunning quality theory from the 1960s to TQC and TQM.
EIA
— Electronics Industry Association (Adelaide, South Australia, Australia)
TG
— Glass Transition Temperature
LCCC
— Leadless Ceramic Chip Carrier
GTA
— Gas Tungsten Arc
LPISM
— Liquid Photo-Imageable Solder Mask
CAGE
— Commercial and Government Entity
RISC
— Reduced Instruction Set Computing
MAC
— Maximum Allowable Concentration
OLB
— Outer-Lead Bonding
QPL
— qualified products list
GMA
— Gas Metal Arc
UBM
— Under Bump Metallization
MA
— Mechanical Advantage
ESI
— Early Supplier Involvement
EDO
— Extended Data Output
DXF
— Data Exchange Format
TIFF
— Tag Image File Format
KGB
— Known Good Board
LSI
— Large Scale Integration -> VLSI
MITI
— Ministry of International Trade and Industry
CET
— Certified Electronic Technician
FAR
— Failure Analysis Report
SERA
— Sequential Electrochemical Reduction Analysis
DK
— Dielectric Constant
PTFE
— Polytetrafluoroethylene
TDR
— Time-Domain Reflectometry
CPLD
— Complex Programmable Logic Device
SEM
— Scanning Electron Microscopes
CITIS
— Contractor Integrated Technical Information Service
CAM
— Computer-Aided Manufacturing
UPH
— Unit Per Hour
MRP II
— manufacturing resource planning
EMF
— Electro-Motive Force
SMD
— Surface Mount Device
KGD
— Known Good Die
DCAS
— Defense Contract Administration Services
MRP
— Material Requirement Planning
ED
— Electrodeposited
UHF
— Ultrahigh Frequency
CASE
— Computer-Aided Software Engineering
EDIF
— Electronic Design Interchange Format
CISC
— Complex Instruction Set Computing
PB
— Printed Board
ENEPIG
— Electroless Nickel Electroless Palladium Immersion Gold
EDA
— Electronic Design Automation
SSI
— Small-Scale Integration
FEP
— fluorinated ethylene-propylene
LIF
— Low Insertion Force
FSCM
— Federal Stock Code for Manufacturers
DOD
— Dissolved Oxygen Demand
CBGA
— Ceramic Ball Grid Array
SEM
— standard electronic module
SIP
— Single Inline Package
APT
— Automatically Programmed Tools
PPO
— PolyPhenylene Oxide
ICAM
— integrated computer-aided manufacturing
EIS
— Engineering Information System
DNC
— Distributed Numerical Control
AXI
— Automated X-Ray Inspection
CALS
— Computer-aided Acquisition and Logistic Support
MCAE
— Mechanical Computer-Aided Engineering
MLB
— Multilayer Board
TOP
— Technical And Office Protocol
DESC
— Defense Electronics Supply Center
PIP
— Pin-In-Paste Technology
MEK
— Methylethyl Ketone
RTV
— Room Temperature Vulcanizer
VAR
— Value-Added Reseller
QTA
— Quick Turn Around
PBGA
— Plastic Ball Grid Array
CFM
— Continuous Flow Manufacturing
ZIP
— zigzag inline package
PVT
— Production Validation Test
AGV
— Automated Guided Vehicle
MELF
— Metal Electrode Face
LGA
— Lang Grid Array
VHF
— Very-High Frequency
DTP
— Diameter True Position
ZAF
— Z-Axis Adhesive Film
CMC
— Copper Moly Copper
AA
— Antenna Array
PWA
— Printed Wiring Assembly
NBR
— Nitrile Butadiene-Acrylonitrile Rubber
GAAS
— Gallium Arsenide Application Symposium
PDES
— Product Data Exchange Specification
RETMA
— Radio Electronics & Television Manufacturers Association
AGR
— Annual Average Growth Rate
ECAD
— Electronic Computer-Aided Design
SOIC
— Small-Outline Integrated Circuit
SMTA
— Surface Mount Technology Association
QFP
— Quad Flatpack Package
GTPBGA
— Glob Top Plastic Ball Grid Array
ISHM
— International Society For Hybrid Microelectronics
ISCET
— International Society of Certified Electronics Technicians
VHDL
— Vhsic Hardware Description Language
GBIB
— General Purpose Interface Bus
ELD
— Electro-Luminescent Diode
IEDR
— Initial Engineering Design Review
DMS
— Dynamic Mechanical Spectroscopy
COB
— Chip-On-Board
DCMC
— Defense Contract Management Command
FMEA
— Fault Mode And Effect Analysis
AVT
— Accelerated Vesication Test
DIP
— Dual-Inline Package
THT
— Through-Hole Technology
C3
— Command,Control And Communicate
QML
— Qualified Manufacturer's List
AOI
— Automated Optical Inspection
DRM
— Drawing Requirements Manual
CMOS
— cargo movement operations system; complimentary metal-oxide semiconductor
DATC
— Design Automation Technical Committee (IEEE)
PRT
— Planar Resistor Technology
LMC
— Least Material Condition
DMSA
— Defense Manufacturers And Suppliers Association
BC
— Buried Capacitance
DTS
— Dock to Stock
ODR
— Oscillating Disk Rheometer
XIP
— Execute In Place
ETPC
— Electrolytic Tough-Pitch Copper
DFM
— Design For Manufacture
CVS
— Cyclic Voltammetry Stripping
BDMA
— Benzyldimethylamine
IEPS
— International Electronic Packaging Society
AIS
— Adhesive Interconnect System
ECL
— Emitter-Coupled Logic
FPT
— Fine-Pitch Technology
ACA
— Anisotropically Conductive Adhesive
VLSI
— Very-Large Scale Integration
ZIF
— Zero-Insertion Force
ILB
— Inner-Lead Bonding
CAT
— Computer-Aided Testing
NECQ
— National Electronics Component Qualification System
OSP
— Organic Solder Preservative
LTCC
— Low Temperature Co-fired Ceramic
HPGL
— Hewlett Packard Graphic Language
ASPARC
— Ability of Solder Paste to Retain Components
CPU
— Capability Performance Upper
NADCAP
— National Aerospace and Defense Contractors Accreditation Procedures
ACCU
— Alternating Current Connection Unit
CAFM
— Computer-Aided Facilities Management
SPICE
— Simulation Program Integrated Circuit Emphasis
CAPP
— Computer-Aided Process Planning
STEP
— Standard For Exchange Of Product Model Data
TFA
— Tree-Based Floorplanning Algorithm
VME
— Versa-Module Electronic
OFHC
— Oxygen-Free High-Conductivity Copper
HASL
— Hot Air Solder Leveler
COD
— Consumed Oxygen Demand
VSAG
— Vhdl Standardization and Analysis Group
C4
— Controlled Collapse Component Connection
RA
— Rosin-Activated
OA
— Organic Acid
FCT
— Functional Circuit Test
FEM
— Finite-Element Modeling
CSA
— Canadian Standards Agency
ECCB
— Electronic Components Certification Board
PHIGS
— Programmer's Hierarchical Interface Graphics Standard
RMA
— Rosin Mildy Activated
NIST
— National Institute For Science And Technology
FCC
— Flat-Conductor Cable
EMPF
— Electronics Manufacturing Productivity Facility
MATS
— Material Transport Segment
AA
— Automatic Acknowledge
MCAD
— Mechanical Computer Aided Design
MLPWB
— Multilayer Printed Wiring Board
R&R
— Repeatability and Reproducibility
DIN
— Deutsches Institute for Normung
TGA
— Thermo Gravimetric Analysis
VHSIC
— Very-High Speed Integrated Circuits
CCAPS
— Circuit Card Assembly And Processing System
HTE
— High Temperature Elongation
TAB
— Tape-Automated Bonding
MCM
— multichip module
PTH
— Plated-Through Hole
EMS
— Electrical Manufacturing Services
TO
— Transistor Outline
COT
— Configure To Order
FEA
— Finite-Element Analysis
R
— Rosin
OSHA
— Occupational Safety Hazards Act
PT
— Positional tolerance
JEDEC
— Solid State Technology Association
AC
— All Call
ULSI
— Ultra-Large Scale Integration
IGES
— Integrated Graphics Exchange System
SOS
— Silicon-On-Sapphire
CSG
— Constructive Solids Geometry
RFI
— Radio-Frequency Interference
EPT
— Ethylene-Propylene Terepolymer
ATG
— Automatic Test Generation
DAB
— Designated Audit Body
BOT
— Build To Order
CIM
— computer-integrated manufacturing
ICA
— Isotropically Conductive Adhesive
PP
— Process Performance
WSI
— Wafer-Scale Integration
RWOH
— Reliability Without Hermeticity
ICT
— Inner Circuit Test
CAF
— Cathotic Anionic Filaments
MIBK
— Methyl-Isobutyl Ketone
CM
— Contract Manufacturer
MIR
— Moisture Insulation Resistance
IDC
— Insulation-Displacement Connection
EPR
— Ethylene-propylene Resin
SMT
— Surface Mounting Technology
SEC
— Solvent Extract Conductivity
PEM
— Plastic Electronic Module
TMA
— Thermo Mechanical Analysis
ITT
— Inter-Test Time
BTAB
— Bumped Tape-Automated Bonding
NMR
— Normal-Mode Rejection
CAR
— Computer-Aided Repair
DOS
— Disc Operating System
CPL
— Capability Performance, Lower
LDA
— Logic Design Automation
EDM
— Electro-Discharge Machining
CEPM
— Certified Ems Program Managers
DIM
— Data-Information Record
ACC
— Advanced Concept Construction Active Control Channel
CP
— Capability Performance
RTS
— Ramp To Spike
IECQ
— International Electronic Component Qualification System
DS
— Double-Sided
SBU
— Sequential Buildup
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