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>> Industry Abbreviations
Look through 366 acronyms and abbreviations related to Industry:
LAN
— Local Area Network
ROM
— Read-Only Memory
ANOVA
— Analysis of Variance (statistics)
FTP
— File Transfer Protocol
BT
— Bismaleimide Triazine
RSS
— Ramp Soak Spike
ANSI
— American National Standards Institute, Inc.
CPU
— Central Processing Unit
LED
— Light-Emitting Diode
DSC
— Differential Scanning Calorimetry
OEM
— Original Equipment Manufacturer (usually in reference to car parts)
WWW
— World Wide Web
PID
— Photo-Imageable Dielectric
LCD
— Liquid Crystal Display
ISO
— International Organization for Standardization
IP
— Internet Protocol
EDI
— Electronic Data Interchange
P&IA
— Packaging And Interconnecting Assembly
AC
— Alternating Current
FET
— Field Effect Transistor
PPM
— parts per million
ROM
— Rough Order of Magnitude
DBMS
— Database Management System
P&IS
— Packaging And Interconnecting Structure
TQM
— Total Quality Management
RFP
— Request For Proposal
SMOBC
— Solder Mask Over Bare Copper
BOD
— Biochemical Oxygen Demand
ABS
— Acrylonitrile, Butadiene, and Styrene
HTTP
— Hypertext Transfer Protocol
MSDS
— Material Safety Data Sheets
ASME
— American Society of Mechanical Engineers
ASTM
— American Society for Testing and Materials (Philadelphia, Pennsylvania)
RFS
— Regardless of Feature Size
MMIC
— Monolithic Microwave Integrated Circuit
MTBF
— Mean Time Before Failure
URL
— Universal Resource Locator
EPA
— Environmental Protection Agency (US)
PCB
— printed circuit board
CAE
— Computer-Aided Engineering
ASCII
— American National Standard Code for Information Interchange
EMP
— Electromagnetic Pulse
FAA
— Federal Aviation Administration
ENIPIG
— Electroless Nickel Immersion Palladium Immersion Gold
ATR
— Air Transport Rack
RAM
— random-access memory
NC
— Numerical Control
NPI
— New Product Introduction
TTL
— Transistor-Transistor Logic
CRT
— Cathode Ray Tube (type of TV)
IC
— Integrated Circuit
CFM
— Cubic Feet per Minute
I/O
— Input/Output
FFT
— Fast Fourier Transform
PVC
— Polyvinyl Chloride
PDL
— Page Description Language
DC
— Direct Current
RPM
— Revolutions Per Minute, (Rotations Per Minute)
DOD
— United States Department of Defense
PLD
— Programmable Logic Device
AGC
— Automatic Gain Control
ECR
— Engineering Change Request
MTTR
— Mean Time To Repair
MOS
— Model Output Statistics
BOM
— Bill of Material
OSI
— Open Systems Interconnection (iso Standard)
RFQ
— Request For Quote
CTE
— Coefficient of Thermal Expansion
ECO
— Engineering Change Order
NSA
— National Security Agency
MAP
— Manufacturing Automation Protocol
PGA
— Pin Grid Array
SQL
— Structured Query Language
FC-PBGA
— Flip Chip Platic Ball Grid Array
PC
— Personal computer (host)
CSP
— Chip Scale Package
DMA
— direct memory access (computer term)
ECC
— Error Correction Code (Error Checking And Correction)
AQL
— Acceptable Quality Level
BITE
— Built-In Test Equipment
AEC
— Architecture, Engineering, Construction
WYSIWYG
— What You See Is What You Get (pronounced Wizzy-wig. See Entry For Derived Acronyms)
WIP
— Work in Process
IEC
— International Electrotechnical Commission
ESD
— Electrostatic Discharge
DOE
— Design Of Experiment
IR
— Infrared
ECN
— Engineering Change Notice
PLCC
— Plastic Leaded Chip Carrier (electronics)
NEMA
— National Electric Manufacturer's Association
MAC
— Media Access Control
DLA
— U.S. Defense Logistics Agency
FCC
— Federal Communications Commission (US)
PSI
— Pounds Per Square Inch (Static Pressure)
SAE
— Society of Automotive Engineers
RPM
— Resale Price Maintenance. The UK Net Book Agreement, as was. Means by which retail prices are controlled by primary suppliers. (Alternatively, Revolutions Per Minute, as in engine speed and 78, 33 and 45 records. In years to come how many people will know
PBX
— Private Branch eXchange (company phone system)
EMC
— Electromagnetic Compatibility
CRC
— Contrôle de Redondance Cyclique (French: Cyclic Redundancy Check)
NBS
— National Bureau of Standards (US)
SFM
— Surface Feet per Minute
IEEE
— Institute of Electrical and Electronic Engineers, Inc.
BGA
— Ball Grid Array [electronic Packaging]
DSP
— Digital Signal Processor
MSI
— Medium-Scale Integration
CNC
— Computer Numerical Control
AWG
— American Wire Gauge
DRC
— Design Rule Check
MMC
— Maximum Material Condition
PPS
— Polyphenylene Sulfide
ARINC
— Aeronautical Radio Incorporated
NASA
— National Aeronautics and Space Administration (US)
RMS
— root mean square (preferred over "RMS")
TCR
— Temperature Coefficient of Resistance
T&C
— Terms & Conditions
FPGA
— Field-Programmable Gate Array
SPC
— Statistical Process Control. Forerunning quality theory from the 1960s to TQC and TQM.
CAD
— Computer-Aided Design
ASQ
— Alpha System Qualification
FC-CBGA
— Flip Chip Ceramic Ball Grid Array
PCMCIA
— Personal Computer Memory Card International Association
C&E
— Cause and Effect
NDT
— Nondestructive Test
LRU
— Lowest Replaceable Unit
VOC
— Volatile Organic Compounds (air pollution)
JIT
— Just-In-Time (inventory management)
SQC
— Statistical Quality Control
CDA
— Copper Development Association Inc.
MDA
— Methylenedianiline
TFE
— Tetrafluoroethylene
CAGE
— Commercial and Government Entity
MRP II
— manufacturing resource planning
DVM
— Digital Voltmeter
PCA
— Printed Circuit Assembly
LBA
— Logical Block Addresses
IPM
— Inches Per Minute
QPL
— qualified products list
OLB
— Outer-Lead Bonding
ENIG
— Electroless Nickel Immersion Gold
TP
— True Position
TCE
— Thermal Coefficient of Expansion
RISC
— Reduced Instruction Set Computing
EIA
— Electronics Industry Association (Adelaide, South Australia, Australia)
LSI
— Large Scale Integration -> VLSI
DCMA
— Defense Contract Management Agency
SIR
— Surface Insulation Resistance
EDO
— Extended Data Output
ESR
— Equivalent Series Resistance
TIFF
— Tag Image File Format
AOQ
— Average Outgoing Quality
SMEMA
— Surface Mount Equipment Manufacturers Association
DXF
— Data Exchange Format
LCCC
— Leadless Ceramic Chip Carrier
UBM
— Under Bump Metallization
LPISM
— Liquid Photo-Imageable Solder Mask
TG
— Glass Transition Temperature
SERA
— Sequential Electrochemical Reduction Analysis
KGB
— Known Good Board
UPH
— Unit Per Hour
GTA
— Gas Tungsten Arc
ESI
— Early Supplier Involvement
MITI
— Ministry of International Trade and Industry
PTFE
— Polytetrafluoroethylene
CPLD
— Complex Programmable Logic Device
MA
— Mechanical Advantage
GMA
— Gas Metal Arc
MAC
— Maximum Allowable Concentration
TDR
— Time-Domain Reflectometry
MRP
— Material Requirement Planning
CET
— Certified Electronic Technician
CAM
— Computer-Aided Manufacturing
KGD
— Known Good Die
CASE
— Computer-Aided Software Engineering
SEM
— Scanning Electron Microscopes
UHF
— Ultrahigh Frequency
CITIS
— Contractor Integrated Technical Information Service
EDA
— Electronic Design Automation
DK
— Dielectric Constant
ENEPIG
— Electroless Nickel Electroless Palladium Immersion Gold
EDIF
— Electronic Design Interchange Format
DCAS
— Defense Contract Administration Services
CISC
— Complex Instruction Set Computing
FAR
— Failure Analysis Report
SSI
— Small-Scale Integration
SMD
— Surface Mount Device
APT
— Automatically Programmed Tools
PB
— Printed Board
FEP
— fluorinated ethylene-propylene
LIF
— Low Insertion Force
EMF
— Electro-Motive Force
MEK
— Methylethyl Ketone
VAR
— Value-Added Reseller
TOP
— Technical And Office Protocol
RTV
— Room Temperature Vulcanizer
ED
— Electrodeposited
PPO
— PolyPhenylene Oxide
MCAE
— Mechanical Computer-Aided Engineering
DESC
— Defense Electronics Supply Center
CBGA
— Ceramic Ball Grid Array
ICAM
— integrated computer-aided manufacturing
PIP
— Pin-In-Paste Technology
CALS
— Computer-aided Acquisition and Logistic Support
DOD
— Dissolved Oxygen Demand
MLB
— Multilayer Board
FSCM
— Federal Stock Code for Manufacturers
PVT
— Production Validation Test
SEM
— standard electronic module
EIS
— Engineering Information System
SIP
— Single Inline Package
DNC
— Distributed Numerical Control
AXI
— Automated X-Ray Inspection
ZIP
— zigzag inline package
CMC
— Copper Moly Copper
CFM
— Continuous Flow Manufacturing
VHF
— Very-High Frequency
ZAF
— Z-Axis Adhesive Film
PBGA
— Plastic Ball Grid Array
QTA
— Quick Turn Around
DTP
— Diameter True Position
SOIC
— Small-Outline Integrated Circuit
MELF
— Metal Electrode Face
CAT
— Computer-Aided Testing
AGV
— Automated Guided Vehicle
AA
— Antenna Array
RETMA
— Radio Electronics & Television Manufacturers Association
LGA
— Lang Grid Array
ILB
— Inner-Lead Bonding
GAAS
— Gallium Arsenide Application Symposium
IEDR
— Initial Engineering Design Review
PDES
— Product Data Exchange Specification
PWA
— Printed Wiring Assembly
AGR
— Annual Average Growth Rate
GTPBGA
— Glob Top Plastic Ball Grid Array
SMTA
— Surface Mount Technology Association
QFP
— Quad Flatpack Package
DIP
— Dual-Inline Package
NBR
— Nitrile Butadiene-Acrylonitrile Rubber
ECAD
— Electronic Computer-Aided Design
R&R
— Repeatability and Reproducibility
VHDL
— Vhsic Hardware Description Language
XIP
— Execute In Place
ISHM
— International Society For Hybrid Microelectronics
ZIF
— Zero-Insertion Force
CAFM
— Computer-Aided Facilities Management
THT
— Through-Hole Technology
ISCET
— International Society of Certified Electronics Technicians
QML
— Qualified Manufacturer's List
DCMC
— Defense Contract Management Command
FMEA
— Fault Mode And Effect Analysis
DATC
— Design Automation Technical Committee (IEEE)
GBIB
— General Purpose Interface Bus
DRM
— Drawing Requirements Manual
DMS
— Dynamic Mechanical Spectroscopy
ACCU
— Alternating Current Connection Unit
AVT
— Accelerated Vesication Test
ELD
— Electro-Luminescent Diode
BC
— Buried Capacitance
DFM
— Design For Manufacture
COB
— Chip-On-Board
DMSA
— Defense Manufacturers And Suppliers Association
DTS
— Dock to Stock
AOI
— Automated Optical Inspection
CMOS
— cargo movement operations system; complimentary metal-oxide semiconductor
PRT
— Planar Resistor Technology
VLSI
— Very-Large Scale Integration
HPGL
— Hewlett Packard Graphic Language
C3
— Command,Control And Communicate
LMC
— Least Material Condition
OFHC
— Oxygen-Free High-Conductivity Copper
ODR
— Oscillating Disk Rheometer
ETPC
— Electrolytic Tough-Pitch Copper
AIS
— Adhesive Interconnect System
CVS
— Cyclic Voltammetry Stripping
HASL
— Hot Air Solder Leveler
ECCB
— Electronic Components Certification Board
FPT
— Fine-Pitch Technology
BDMA
— Benzyldimethylamine
VHSIC
— Very-High Speed Integrated Circuits
ACA
— Anisotropically Conductive Adhesive
IEPS
— International Electronic Packaging Society
SPICE
— Simulation Program Integrated Circuit Emphasis
ASPARC
— Ability of Solder Paste to Retain Components
TO
— Transistor Outline
CPU
— Capability Performance Upper
VSAG
— Vhdl Standardization and Analysis Group
OSP
— Organic Solder Preservative
DAB
— Designated Audit Body
LTCC
— Low Temperature Co-fired Ceramic
ITT
— Inter-Test Time
VME
— Versa-Module Electronic
C4
— Controlled Collapse Component Connection
FEM
— Finite-Element Modeling
CSA
— Canadian Standards Agency
ECL
— Emitter-Coupled Logic
NECQ
— National Electronics Component Qualification System
TFA
— Tree-Based Floorplanning Algorithm
NIST
— National Institute For Science And Technology
NADCAP
— National Aerospace and Defense Contractors Accreditation Procedures
COT
— Configure To Order
CAPP
— Computer-Aided Process Planning
COD
— Consumed Oxygen Demand
STEP
— Standard For Exchange Of Product Model Data
EMS
— Electrical Manufacturing Services
FEA
— Finite-Element Analysis
FCT
— Functional Circuit Test
OA
— Organic Acid
IGES
— Integrated Graphics Exchange System
PHIGS
— Programmer's Hierarchical Interface Graphics Standard
RMA
— Rosin Mildy Activated
CCAPS
— Circuit Card Assembly And Processing System
EMPF
— Electronics Manufacturing Productivity Facility
PTH
— Plated-Through Hole
AA
— Automatic Acknowledge
WSI
— Wafer-Scale Integration
RA
— Rosin-Activated
MCAD
— Mechanical Computer Aided Design
MLPWB
— Multilayer Printed Wiring Board
DIN
— Deutsches Institute for Normung
TAB
— Tape-Automated Bonding
FCC
— Flat-Conductor Cable
PT
— Positional tolerance
MATS
— Material Transport Segment
R
— Rosin
TGA
— Thermo Gravimetric Analysis
HTE
— High Temperature Elongation
BOT
— Build To Order
MCM
— multichip module
BTAB
— Bumped Tape-Automated Bonding
AC
— All Call
RWOH
— Reliability Without Hermeticity
DOS
— Disc Operating System
ULSI
— Ultra-Large Scale Integration
CIM
— computer-integrated manufacturing
PP
— Process Performance
JEDEC
— Solid State Technology Association
NMR
— Normal-Mode Rejection
MIBK
— Methyl-Isobutyl Ketone
SMT
— Surface Mounting Technology
SEC
— Solvent Extract Conductivity
SOS
— Silicon-On-Sapphire
EPT
— Ethylene-Propylene Terepolymer
OSHA
— Occupational Safety Hazards Act
ATG
— Automatic Test Generation
TMA
— Thermo Mechanical Analysis
ICA
— Isotropically Conductive Adhesive
ICT
— Inner Circuit Test
CM
— Contract Manufacturer
MIR
— Moisture Insulation Resistance
IDC
— Insulation-Displacement Connection
CAF
— Cathotic Anionic Filaments
EPR
— Ethylene-propylene Resin
IECQ
— International Electronic Component Qualification System
LDA
— Logic Design Automation
RFI
— Radio-Frequency Interference
CSG
— Constructive Solids Geometry
PEM
— Plastic Electronic Module
EDM
— Electro-Discharge Machining
CAR
— Computer-Aided Repair
ACC
— Advanced Concept Construction Active Control Channel
CPL
— Capability Performance, Lower
CEPM
— Certified Ems Program Managers
DIM
— Data-Information Record
RTS
— Ramp To Spike
SBU
— Sequential Buildup
DS
— Double-Sided
CP
— Capability Performance
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