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>> Industry Abbreviations
Look through 366 acronyms and abbreviations related to Industry:
URL
— Universal Resource Locator
LAN
— Local Area Network
PID
— Photo-Imageable Dielectric
OEM
— Original Equipment Manufacturer (usually in reference to car parts)
PPM
— parts per million
ROM
— Read-Only Memory
FTP
— File Transfer Protocol
ANSI
— American National Standards Institute, Inc.
ANOVA
— Analysis of Variance (statistics)
ROM
— Rough Order of Magnitude
EPA
— Environmental Protection Agency (US)
CPU
— Central Processing Unit
LED
— Light-Emitting Diode
ISO
— International Organization for Standardization
IP
— Internet Protocol
RFP
— Request For Proposal
AC
— Alternating Current
ASTM
— American Society for Testing and Materials (Philadelphia, Pennsylvania)
MSDS
— Material Safety Data Sheets
RPM
— Revolutions Per Minute, (Rotations Per Minute)
MTBF
— Mean Time Before Failure
EDI
— Electronic Data Interchange
TQM
— Total Quality Management
ASCII
— American National Standard Code for Information Interchange
LCD
— Liquid Crystal Display
CRT
— Cathode Ray Tube (type of TV)
ECR
— Engineering Change Request
BT
— Bismaleimide Triazine
FET
— Field Effect Transistor
P&IA
— Packaging And Interconnecting Assembly
SMOBC
— Solder Mask Over Bare Copper
ASME
— American Society of Mechanical Engineers
HTTP
— Hypertext Transfer Protocol
P&IS
— Packaging And Interconnecting Structure
RSS
— Ramp Soak Spike
PCB
— printed circuit board
DOD
— United States Department of Defense
WWW
— World Wide Web
ENIPIG
— Electroless Nickel Immersion Palladium Immersion Gold
RAM
— random-access memory
DSC
— Differential Scanning Calorimetry
AGC
— Automatic Gain Control
CAE
— Computer-Aided Engineering
MAP
— Manufacturing Automation Protocol
FAA
— Federal Aviation Administration
NPI
— New Product Introduction
WIP
— Work in Process
MTTR
— Mean Time To Repair
ECN
— Engineering Change Notice
ECO
— Engineering Change Order
PC
— Personal computer (host)
RPM
— Resale Price Maintenance. The UK Net Book Agreement, as was. Means by which retail prices are controlled by primary suppliers. (Alternatively, Revolutions Per Minute, as in engine speed and 78, 33 and 45 records. In years to come how many people will know
CFM
— Cubic Feet per Minute
ECC
— Error Correction Code (Error Checking And Correction)
DBMS
— Database Management System
WYSIWYG
— What You See Is What You Get (pronounced Wizzy-wig. See Entry For Derived Acronyms)
PSI
— Pounds Per Square Inch (Static Pressure)
FFT
— Fast Fourier Transform
SQL
— Structured Query Language
BOM
— Bill of Material
BOD
— Biochemical Oxygen Demand
FCC
— Federal Communications Commission (US)
NC
— Numerical Control
AQL
— Acceptable Quality Level
DLA
— U.S. Defense Logistics Agency
RFS
— Regardless of Feature Size
MMIC
— Monolithic Microwave Integrated Circuit
T&C
— Terms & Conditions
DC
— Direct Current
MRP II
— manufacturing resource planning
TTL
— Transistor-Transistor Logic
FC-PBGA
— Flip Chip Platic Ball Grid Array
NEMA
— National Electric Manufacturer's Association
AWG
— American Wire Gauge
SAE
— Society of Automotive Engineers
ABS
— Acrylonitrile, Butadiene, and Styrene
PBX
— Private Branch eXchange (company phone system)
SPC
— Statistical Process Control. Forerunning quality theory from the 1960s to TQC and TQM.
RFQ
— Request For Quote
DOE
— Design Of Experiment
IC
— Integrated Circuit
EMP
— Electromagnetic Pulse
CNC
— Computer Numerical Control
PVC
— Polyvinyl Chloride
ESD
— Electrostatic Discharge
MAC
— Media Access Control
AEC
— Architecture, Engineering, Construction
CRC
— Contrôle de Redondance Cyclique (French: Cyclic Redundancy Check)
NBS
— National Bureau of Standards (US)
RMS
— root mean square (preferred over "RMS")
DMA
— direct memory access (computer term)
NSA
— National Security Agency
IR
— Infrared
SQC
— Statistical Quality Control
ASQ
— Alpha System Qualification
SFM
— Surface Feet per Minute
I/O
— Input/Output
IEEE
— Institute of Electrical and Electronic Engineers, Inc.
ATR
— Air Transport Rack
EMC
— Electromagnetic Compatibility
C&E
— Cause and Effect
PDL
— Page Description Language
PLCC
— Plastic Leaded Chip Carrier (electronics)
PLD
— Programmable Logic Device
IEC
— International Electrotechnical Commission
OSI
— Open Systems Interconnection (iso Standard)
UBM
— Under Bump Metallization
CAD
— Computer-Aided Design
DSP
— Digital Signal Processor
BITE
— Built-In Test Equipment
PCMCIA
— Personal Computer Memory Card International Association
CAGE
— Commercial and Government Entity
MSI
— Medium-Scale Integration
QPL
— qualified products list
DRC
— Design Rule Check
MOS
— Model Output Statistics
VOC
— Volatile Organic Compounds (air pollution)
FC-CBGA
— Flip Chip Ceramic Ball Grid Array
CTE
— Coefficient of Thermal Expansion
NDT
— Nondestructive Test
PGA
— Pin Grid Array
NASA
— National Aeronautics and Space Administration (US)
CSP
— Chip Scale Package
ARINC
— Aeronautical Radio Incorporated
BGA
— Ball Grid Array [electronic Packaging]
ENIG
— Electroless Nickel Immersion Gold
JIT
— Just-In-Time (inventory management)
MMC
— Maximum Material Condition
MDA
— Methylenedianiline
TCR
— Temperature Coefficient of Resistance
OLB
— Outer-Lead Bonding
PPS
— Polyphenylene Sulfide
FPGA
— Field-Programmable Gate Array
DVM
— Digital Voltmeter
UPH
— Unit Per Hour
PTFE
— Polytetrafluoroethylene
LSI
— Large Scale Integration -> VLSI
TIFF
— Tag Image File Format
DCMA
— Defense Contract Management Agency
AOQ
— Average Outgoing Quality
RISC
— Reduced Instruction Set Computing
EIA
— Electronics Industry Association (Adelaide, South Australia, Australia)
SERA
— Sequential Electrochemical Reduction Analysis
ENEPIG
— Electroless Nickel Electroless Palladium Immersion Gold
MRP
— Material Requirement Planning
LBA
— Logical Block Addresses
TP
— True Position
CDA
— Copper Development Association Inc.
CAM
— Computer-Aided Manufacturing
EDO
— Extended Data Output
TDR
— Time-Domain Reflectometry
CPLD
— Complex Programmable Logic Device
PCA
— Printed Circuit Assembly
DCAS
— Defense Contract Administration Services
CITIS
— Contractor Integrated Technical Information Service
MITI
— Ministry of International Trade and Industry
ILB
— Inner-Lead Bonding
KGB
— Known Good Board
IPM
— Inches Per Minute
CASE
— Computer-Aided Software Engineering
SEM
— Scanning Electron Microscopes
PIP
— Pin-In-Paste Technology
EDA
— Electronic Design Automation
DXF
— Data Exchange Format
TFE
— Tetrafluoroethylene
EDIF
— Electronic Design Interchange Format
TG
— Glass Transition Temperature
CALS
— Computer-aided Acquisition and Logistic Support
UHF
— Ultrahigh Frequency
ESI
— Early Supplier Involvement
KGD
— Known Good Die
SSI
— Small-Scale Integration
TOP
— Technical And Office Protocol
DESC
— Defense Electronics Supply Center
LRU
— Lowest Replaceable Unit
RTV
— Room Temperature Vulcanizer
CISC
— Complex Instruction Set Computing
PVT
— Production Validation Test
LIF
— Low Insertion Force
FEP
— fluorinated ethylene-propylene
SMEMA
— Surface Mount Equipment Manufacturers Association
LCCC
— Leadless Ceramic Chip Carrier
PPO
— PolyPhenylene Oxide
CET
— Certified Electronic Technician
VAR
— Value-Added Reseller
MEK
— Methylethyl Ketone
ICAM
— integrated computer-aided manufacturing
APT
— Automatically Programmed Tools
MCAE
— Mechanical Computer-Aided Engineering
DTS
— Dock to Stock
ESR
— Equivalent Series Resistance
MAC
— Maximum Allowable Concentration
CAT
— Computer-Aided Testing
MLB
— Multilayer Board
SPICE
— Simulation Program Integrated Circuit Emphasis
VHF
— Very-High Frequency
EMS
— Electrical Manufacturing Services
TCE
— Thermal Coefficient of Expansion
SIR
— Surface Insulation Resistance
GMA
— Gas Metal Arc
CAPP
— Computer-Aided Process Planning
GTA
— Gas Tungsten Arc
AGV
— Automated Guided Vehicle
LPISM
— Liquid Photo-Imageable Solder Mask
DNC
— Distributed Numerical Control
CFM
— Continuous Flow Manufacturing
ZAF
— Z-Axis Adhesive Film
FAR
— Failure Analysis Report
EIS
— Engineering Information System
CBGA
— Ceramic Ball Grid Array
PB
— Printed Board
DK
— Dielectric Constant
SMD
— Surface Mount Device
MA
— Mechanical Advantage
CMC
— Copper Moly Copper
PBGA
— Plastic Ball Grid Array
ECAD
— Electronic Computer-Aided Design
DOD
— Dissolved Oxygen Demand
FSCM
— Federal Stock Code for Manufacturers
XIP
— Execute In Place
ZIP
— zigzag inline package
AXI
— Automated X-Ray Inspection
ED
— Electrodeposited
CVS
— Cyclic Voltammetry Stripping
EMF
— Electro-Motive Force
CCAPS
— Circuit Card Assembly And Processing System
NBR
— Nitrile Butadiene-Acrylonitrile Rubber
QTA
— Quick Turn Around
ACCU
— Alternating Current Connection Unit
PWA
— Printed Wiring Assembly
CAFM
— Computer-Aided Facilities Management
AA
— Antenna Array
RETMA
— Radio Electronics & Television Manufacturers Association
SOIC
— Small-Outline Integrated Circuit
ETPC
— Electrolytic Tough-Pitch Copper
SEM
— standard electronic module
AGR
— Annual Average Growth Rate
AVT
— Accelerated Vesication Test
PDES
— Product Data Exchange Specification
SIP
— Single Inline Package
BDMA
— Benzyldimethylamine
SMTA
— Surface Mount Technology Association
GAAS
— Gallium Arsenide Application Symposium
ASPARC
— Ability of Solder Paste to Retain Components
LGA
— Lang Grid Array
DCMC
— Defense Contract Management Command
ACA
— Anisotropically Conductive Adhesive
THT
— Through-Hole Technology
AIS
— Adhesive Interconnect System
CPU
— Capability Performance Upper
CMOS
— cargo movement operations system; complimentary metal-oxide semiconductor
DRM
— Drawing Requirements Manual
ZIF
— Zero-Insertion Force
VHDL
— Vhsic Hardware Description Language
GTPBGA
— Glob Top Plastic Ball Grid Array
DMS
— Dynamic Mechanical Spectroscopy
FMEA
— Fault Mode And Effect Analysis
ATG
— Automatic Test Generation
DIP
— Dual-Inline Package
QML
— Qualified Manufacturer's List
MELF
— Metal Electrode Face
EMPF
— Electronics Manufacturing Productivity Facility
QFP
— Quad Flatpack Package
COB
— Chip-On-Board
DTP
— Diameter True Position
IEPS
— International Electronic Packaging Society
IEDR
— Initial Engineering Design Review
VLSI
— Very-Large Scale Integration
AOI
— Automated Optical Inspection
R&R
— Repeatability and Reproducibility
COD
— Consumed Oxygen Demand
HPGL
— Hewlett Packard Graphic Language
ISHM
— International Society For Hybrid Microelectronics
ODR
— Oscillating Disk Rheometer
LTCC
— Low Temperature Co-fired Ceramic
NIST
— National Institute For Science And Technology
BC
— Buried Capacitance
NADCAP
— National Aerospace and Defense Contractors Accreditation Procedures
MCAD
— Mechanical Computer Aided Design
ECCB
— Electronic Components Certification Board
AA
— Automatic Acknowledge
GBIB
— General Purpose Interface Bus
VME
— Versa-Module Electronic
SMT
— Surface Mounting Technology
DATC
— Design Automation Technical Committee (IEEE)
CAR
— Computer-Aided Repair
AC
— All Call
C3
— Command,Control And Communicate
C4
— Controlled Collapse Component Connection
OFHC
— Oxygen-Free High-Conductivity Copper
FPT
— Fine-Pitch Technology
DAB
— Designated Audit Body
ITT
— Inter-Test Time
DFM
— Design For Manufacture
ISCET
— International Society of Certified Electronics Technicians
DMSA
— Defense Manufacturers And Suppliers Association
ECL
— Emitter-Coupled Logic
HTE
— High Temperature Elongation
ELD
— Electro-Luminescent Diode
FEM
— Finite-Element Modeling
NECQ
— National Electronics Component Qualification System
LMC
— Least Material Condition
RWOH
— Reliability Without Hermeticity
WSI
— Wafer-Scale Integration
TGA
— Thermo Gravimetric Analysis
TAB
— Tape-Automated Bonding
TFA
— Tree-Based Floorplanning Algorithm
CSA
— Canadian Standards Agency
RFI
— Radio-Frequency Interference
PHIGS
— Programmer's Hierarchical Interface Graphics Standard
VHSIC
— Very-High Speed Integrated Circuits
TMA
— Thermo Mechanical Analysis
FEA
— Finite-Element Analysis
LDA
— Logic Design Automation
PTH
— Plated-Through Hole
CM
— Contract Manufacturer
OA
— Organic Acid
ULSI
— Ultra-Large Scale Integration
MLPWB
— Multilayer Printed Wiring Board
VSAG
— Vhdl Standardization and Analysis Group
SOS
— Silicon-On-Sapphire
IGES
— Integrated Graphics Exchange System
STEP
— Standard For Exchange Of Product Model Data
BTAB
— Bumped Tape-Automated Bonding
TO
— Transistor Outline
PRT
— Planar Resistor Technology
CAF
— Cathotic Anionic Filaments
OSP
— Organic Solder Preservative
BOT
— Build To Order
CEPM
— Certified Ems Program Managers
DIM
— Data-Information Record
RA
— Rosin-Activated
COT
— Configure To Order
HASL
— Hot Air Solder Leveler
RMA
— Rosin Mildy Activated
CIM
— computer-integrated manufacturing
FCC
— Flat-Conductor Cable
NMR
— Normal-Mode Rejection
ACC
— Advanced Concept Construction Active Control Channel
CPL
— Capability Performance, Lower
MIBK
— Methyl-Isobutyl Ketone
EDM
— Electro-Discharge Machining
PP
— Process Performance
DIN
— Deutsches Institute for Normung
EPT
— Ethylene-Propylene Terepolymer
FCT
— Functional Circuit Test
IDC
— Insulation-Displacement Connection
DOS
— Disc Operating System
CP
— Capability Performance
JEDEC
— Solid State Technology Association
R
— Rosin
MCM
— multichip module
IECQ
— International Electronic Component Qualification System
DS
— Double-Sided
RTS
— Ramp To Spike
ICA
— Isotropically Conductive Adhesive
MATS
— Material Transport Segment
MIR
— Moisture Insulation Resistance
OSHA
— Occupational Safety Hazards Act
EPR
— Ethylene-propylene Resin
CSG
— Constructive Solids Geometry
PT
— Positional tolerance
ICT
— Inner Circuit Test
SBU
— Sequential Buildup
PEM
— Plastic Electronic Module
SEC
— Solvent Extract Conductivity
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