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>> Industry Abbreviations
Look through 366 acronyms and abbreviations related to Industry:
LAN
— Local Area Network
ROM
— Read-Only Memory
ANOVA
— Analysis of Variance (statistics)
FTP
— File Transfer Protocol
RSS
— Ramp Soak Spike
ANSI
— American National Standards Institute, Inc.
BT
— Bismaleimide Triazine
LED
— Light-Emitting Diode
CPU
— Central Processing Unit
OEM
— Original Equipment Manufacturer (usually in reference to car parts)
DSC
— Differential Scanning Calorimetry
P&IA
— Packaging And Interconnecting Assembly
WWW
— World Wide Web
ISO
— International Organization for Standardization
LCD
— Liquid Crystal Display
PID
— Photo-Imageable Dielectric
IP
— Internet Protocol
P&IS
— Packaging And Interconnecting Structure
EDI
— Electronic Data Interchange
AC
— Alternating Current
FET
— Field Effect Transistor
PPM
— parts per million
ROM
— Rough Order of Magnitude
MSDS
— Material Safety Data Sheets
TQM
— Total Quality Management
DBMS
— Database Management System
SMOBC
— Solder Mask Over Bare Copper
RFP
— Request For Proposal
HTTP
— Hypertext Transfer Protocol
ASME
— American Society of Mechanical Engineers
ASTM
— American Society for Testing and Materials (Philadelphia, Pennsylvania)
BOD
— Biochemical Oxygen Demand
ABS
— Acrylonitrile, Butadiene, and Styrene
URL
— Universal Resource Locator
ASCII
— American National Standard Code for Information Interchange
EPA
— Environmental Protection Agency (US)
MTBF
— Mean Time Before Failure
PCB
— printed circuit board
MMIC
— Monolithic Microwave Integrated Circuit
RFS
— Regardless of Feature Size
CAE
— Computer-Aided Engineering
FAA
— Federal Aviation Administration
ENIPIG
— Electroless Nickel Immersion Palladium Immersion Gold
EMP
— Electromagnetic Pulse
RAM
— random-access memory
ATR
— Air Transport Rack
CRT
— Cathode Ray Tube (type of TV)
NC
— Numerical Control
NPI
— New Product Introduction
CFM
— Cubic Feet per Minute
IC
— Integrated Circuit
TTL
— Transistor-Transistor Logic
I/O
— Input/Output
DOD
— United States Department of Defense
FFT
— Fast Fourier Transform
PVC
— Polyvinyl Chloride
RPM
— Revolutions Per Minute, (Rotations Per Minute)
ECR
— Engineering Change Request
DC
— Direct Current
PDL
— Page Description Language
MTTR
— Mean Time To Repair
AGC
— Automatic Gain Control
PLD
— Programmable Logic Device
ECO
— Engineering Change Order
RFQ
— Request For Quote
BOM
— Bill of Material
MOS
— Model Output Statistics
OSI
— Open Systems Interconnection (iso Standard)
NSA
— National Security Agency
MAP
— Manufacturing Automation Protocol
CTE
— Coefficient of Thermal Expansion
PC
— Personal computer (host)
PGA
— Pin Grid Array
SQL
— Structured Query Language
FC-PBGA
— Flip Chip Platic Ball Grid Array
AQL
— Acceptable Quality Level
DMA
— direct memory access (computer term)
WYSIWYG
— What You See Is What You Get (pronounced Wizzy-wig. See Entry For Derived Acronyms)
BITE
— Built-In Test Equipment
ECC
— Error Correction Code (Error Checking And Correction)
WIP
— Work in Process
RPM
— Resale Price Maintenance. The UK Net Book Agreement, as was. Means by which retail prices are controlled by primary suppliers. (Alternatively, Revolutions Per Minute, as in engine speed and 78, 33 and 45 records. In years to come how many people will know
CSP
— Chip Scale Package
AEC
— Architecture, Engineering, Construction
ESD
— Electrostatic Discharge
IEC
— International Electrotechnical Commission
ECN
— Engineering Change Notice
NEMA
— National Electric Manufacturer's Association
DOE
— Design Of Experiment
IR
— Infrared
FCC
— Federal Communications Commission (US)
MAC
— Media Access Control
PLCC
— Plastic Leaded Chip Carrier (electronics)
PSI
— Pounds Per Square Inch (Static Pressure)
DLA
— U.S. Defense Logistics Agency
SAE
— Society of Automotive Engineers
PBX
— Private Branch eXchange (company phone system)
CRC
— Contrôle de Redondance Cyclique (French: Cyclic Redundancy Check)
NBS
— National Bureau of Standards (US)
EMC
— Electromagnetic Compatibility
AWG
— American Wire Gauge
DSP
— Digital Signal Processor
IEEE
— Institute of Electrical and Electronic Engineers, Inc.
SFM
— Surface Feet per Minute
MSI
— Medium-Scale Integration
BGA
— Ball Grid Array [electronic Packaging]
CNC
— Computer Numerical Control
RMS
— root mean square (preferred over "RMS")
ASQ
— Alpha System Qualification
NASA
— National Aeronautics and Space Administration (US)
PPS
— Polyphenylene Sulfide
ARINC
— Aeronautical Radio Incorporated
DRC
— Design Rule Check
MMC
— Maximum Material Condition
PCMCIA
— Personal Computer Memory Card International Association
T&C
— Terms & Conditions
SPC
— Statistical Process Control. Forerunning quality theory from the 1960s to TQC and TQM.
FPGA
— Field-Programmable Gate Array
TCR
— Temperature Coefficient of Resistance
CAD
— Computer-Aided Design
C&E
— Cause and Effect
NDT
— Nondestructive Test
SQC
— Statistical Quality Control
MRP II
— manufacturing resource planning
JIT
— Just-In-Time (inventory management)
LRU
— Lowest Replaceable Unit
VOC
— Volatile Organic Compounds (air pollution)
CAGE
— Commercial and Government Entity
FC-CBGA
— Flip Chip Ceramic Ball Grid Array
TFE
— Tetrafluoroethylene
QPL
— qualified products list
MDA
— Methylenedianiline
CDA
— Copper Development Association Inc.
DVM
— Digital Voltmeter
LBA
— Logical Block Addresses
OLB
— Outer-Lead Bonding
PCA
— Printed Circuit Assembly
RISC
— Reduced Instruction Set Computing
IPM
— Inches Per Minute
ENIG
— Electroless Nickel Immersion Gold
TP
— True Position
LSI
— Large Scale Integration -> VLSI
EDO
— Extended Data Output
EIA
— Electronics Industry Association (Adelaide, South Australia, Australia)
TCE
— Thermal Coefficient of Expansion
DCMA
— Defense Contract Management Agency
UPH
— Unit Per Hour
TIFF
— Tag Image File Format
SIR
— Surface Insulation Resistance
ESR
— Equivalent Series Resistance
AOQ
— Average Outgoing Quality
SMEMA
— Surface Mount Equipment Manufacturers Association
DXF
— Data Exchange Format
LCCC
— Leadless Ceramic Chip Carrier
KGB
— Known Good Board
MITI
— Ministry of International Trade and Industry
UBM
— Under Bump Metallization
SERA
— Sequential Electrochemical Reduction Analysis
LPISM
— Liquid Photo-Imageable Solder Mask
TG
— Glass Transition Temperature
ESI
— Early Supplier Involvement
MRP
— Material Requirement Planning
PTFE
— Polytetrafluoroethylene
TDR
— Time-Domain Reflectometry
GTA
— Gas Tungsten Arc
CAM
— Computer-Aided Manufacturing
CPLD
— Complex Programmable Logic Device
GMA
— Gas Metal Arc
MA
— Mechanical Advantage
MAC
— Maximum Allowable Concentration
SEM
— Scanning Electron Microscopes
CET
— Certified Electronic Technician
UHF
— Ultrahigh Frequency
CASE
— Computer-Aided Software Engineering
KGD
— Known Good Die
DCAS
— Defense Contract Administration Services
EDIF
— Electronic Design Interchange Format
CISC
— Complex Instruction Set Computing
EDA
— Electronic Design Automation
CITIS
— Contractor Integrated Technical Information Service
DK
— Dielectric Constant
SMD
— Surface Mount Device
ENEPIG
— Electroless Nickel Electroless Palladium Immersion Gold
SSI
— Small-Scale Integration
FAR
— Failure Analysis Report
LIF
— Low Insertion Force
FEP
— fluorinated ethylene-propylene
APT
— Automatically Programmed Tools
PB
— Printed Board
VAR
— Value-Added Reseller
PPO
— PolyPhenylene Oxide
MEK
— Methylethyl Ketone
TOP
— Technical And Office Protocol
EMF
— Electro-Motive Force
RTV
— Room Temperature Vulcanizer
MCAE
— Mechanical Computer-Aided Engineering
ED
— Electrodeposited
CBGA
— Ceramic Ball Grid Array
CALS
— Computer-aided Acquisition and Logistic Support
ICAM
— integrated computer-aided manufacturing
DESC
— Defense Electronics Supply Center
PIP
— Pin-In-Paste Technology
DOD
— Dissolved Oxygen Demand
MLB
— Multilayer Board
FSCM
— Federal Stock Code for Manufacturers
PVT
— Production Validation Test
SEM
— standard electronic module
EIS
— Engineering Information System
AXI
— Automated X-Ray Inspection
ZIP
— zigzag inline package
SIP
— Single Inline Package
DNC
— Distributed Numerical Control
ILB
— Inner-Lead Bonding
CMC
— Copper Moly Copper
VHF
— Very-High Frequency
ZAF
— Z-Axis Adhesive Film
PBGA
— Plastic Ball Grid Array
CFM
— Continuous Flow Manufacturing
CAT
— Computer-Aided Testing
QTA
— Quick Turn Around
AGV
— Automated Guided Vehicle
DTP
— Diameter True Position
SOIC
— Small-Outline Integrated Circuit
MELF
— Metal Electrode Face
AA
— Antenna Array
RETMA
— Radio Electronics & Television Manufacturers Association
LGA
— Lang Grid Array
GAAS
— Gallium Arsenide Application Symposium
PDES
— Product Data Exchange Specification
NBR
— Nitrile Butadiene-Acrylonitrile Rubber
IEDR
— Initial Engineering Design Review
PWA
— Printed Wiring Assembly
AGR
— Annual Average Growth Rate
GTPBGA
— Glob Top Plastic Ball Grid Array
SMTA
— Surface Mount Technology Association
DIP
— Dual-Inline Package
QFP
— Quad Flatpack Package
ACCU
— Alternating Current Connection Unit
VHDL
— Vhsic Hardware Description Language
XIP
— Execute In Place
THT
— Through-Hole Technology
ECAD
— Electronic Computer-Aided Design
ZIF
— Zero-Insertion Force
R&R
— Repeatability and Reproducibility
CAFM
— Computer-Aided Facilities Management
DCMC
— Defense Contract Management Command
ISHM
— International Society For Hybrid Microelectronics
ACA
— Anisotropically Conductive Adhesive
OFHC
— Oxygen-Free High-Conductivity Copper
VHSIC
— Very-High Speed Integrated Circuits
DMS
— Dynamic Mechanical Spectroscopy
ISCET
— International Society of Certified Electronics Technicians
QML
— Qualified Manufacturer's List
FMEA
— Fault Mode And Effect Analysis
AVT
— Accelerated Vesication Test
DATC
— Design Automation Technical Committee (IEEE)
GBIB
— General Purpose Interface Bus
DRM
— Drawing Requirements Manual
BC
— Buried Capacitance
FPT
— Fine-Pitch Technology
ELD
— Electro-Luminescent Diode
HPGL
— Hewlett Packard Graphic Language
DMSA
— Defense Manufacturers And Suppliers Association
DFM
— Design For Manufacture
COB
— Chip-On-Board
DTS
— Dock to Stock
AOI
— Automated Optical Inspection
BDMA
— Benzyldimethylamine
CMOS
— cargo movement operations system; complimentary metal-oxide semiconductor
PRT
— Planar Resistor Technology
VLSI
— Very-Large Scale Integration
AIS
— Adhesive Interconnect System
C3
— Command,Control And Communicate
LMC
— Least Material Condition
ODR
— Oscillating Disk Rheometer
STEP
— Standard For Exchange Of Product Model Data
ETPC
— Electrolytic Tough-Pitch Copper
ASPARC
— Ability of Solder Paste to Retain Components
RA
— Rosin-Activated
CVS
— Cyclic Voltammetry Stripping
HASL
— Hot Air Solder Leveler
ECCB
— Electronic Components Certification Board
SPICE
— Simulation Program Integrated Circuit Emphasis
DAB
— Designated Audit Body
IEPS
— International Electronic Packaging Society
RWOH
— Reliability Without Hermeticity
ECL
— Emitter-Coupled Logic
FCC
— Flat-Conductor Cable
LTCC
— Low Temperature Co-fired Ceramic
ITT
— Inter-Test Time
TO
— Transistor Outline
CPU
— Capability Performance Upper
FEM
— Finite-Element Modeling
VSAG
— Vhdl Standardization and Analysis Group
RFI
— Radio-Frequency Interference
OSP
— Organic Solder Preservative
NIST
— National Institute For Science And Technology
VME
— Versa-Module Electronic
C4
— Controlled Collapse Component Connection
NADCAP
— National Aerospace and Defense Contractors Accreditation Procedures
CSA
— Canadian Standards Agency
NECQ
— National Electronics Component Qualification System
TFA
— Tree-Based Floorplanning Algorithm
AA
— Automatic Acknowledge
COT
— Configure To Order
CAPP
— Computer-Aided Process Planning
COD
— Consumed Oxygen Demand
EMS
— Electrical Manufacturing Services
OA
— Organic Acid
FEA
— Finite-Element Analysis
FCT
— Functional Circuit Test
IGES
— Integrated Graphics Exchange System
PHIGS
— Programmer's Hierarchical Interface Graphics Standard
RMA
— Rosin Mildy Activated
TMA
— Thermo Mechanical Analysis
CCAPS
— Circuit Card Assembly And Processing System
BTAB
— Bumped Tape-Automated Bonding
EMPF
— Electronics Manufacturing Productivity Facility
PTH
— Plated-Through Hole
WSI
— Wafer-Scale Integration
MCAD
— Mechanical Computer Aided Design
MLPWB
— Multilayer Printed Wiring Board
DIN
— Deutsches Institute for Normung
SOS
— Silicon-On-Sapphire
TGA
— Thermo Gravimetric Analysis
TAB
— Tape-Automated Bonding
PT
— Positional tolerance
MATS
— Material Transport Segment
DOS
— Disc Operating System
R
— Rosin
ATG
— Automatic Test Generation
HTE
— High Temperature Elongation
BOT
— Build To Order
MCM
— multichip module
AC
— All Call
MIBK
— Methyl-Isobutyl Ketone
SMT
— Surface Mounting Technology
ULSI
— Ultra-Large Scale Integration
EPT
— Ethylene-Propylene Terepolymer
OSHA
— Occupational Safety Hazards Act
CIM
— computer-integrated manufacturing
NMR
— Normal-Mode Rejection
PP
— Process Performance
JEDEC
— Solid State Technology Association
IDC
— Insulation-Displacement Connection
LDA
— Logic Design Automation
SEC
— Solvent Extract Conductivity
CSG
— Constructive Solids Geometry
PEM
— Plastic Electronic Module
ICA
— Isotropically Conductive Adhesive
ICT
— Inner Circuit Test
CM
— Contract Manufacturer
SBU
— Sequential Buildup
MIR
— Moisture Insulation Resistance
CAF
— Cathotic Anionic Filaments
EPR
— Ethylene-propylene Resin
IECQ
— International Electronic Component Qualification System
EDM
— Electro-Discharge Machining
CEPM
— Certified Ems Program Managers
CAR
— Computer-Aided Repair
ACC
— Advanced Concept Construction Active Control Channel
CPL
— Capability Performance, Lower
DIM
— Data-Information Record
RTS
— Ramp To Spike
CP
— Capability Performance
DS
— Double-Sided
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