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>> Industry Abbreviations
Look through 366 acronyms and abbreviations related to Industry:
LAN
— Local Area Network
ROM
— Read-Only Memory
ANOVA
— Analysis of Variance (statistics)
FTP
— File Transfer Protocol
BT
— Bismaleimide Triazine
ANSI
— American National Standards Institute, Inc.
DSC
— Differential Scanning Calorimetry
CPU
— Central Processing Unit
LED
— Light-Emitting Diode
RSS
— Ramp Soak Spike
WWW
— World Wide Web
OEM
— Original Equipment Manufacturer (usually in reference to car parts)
PID
— Photo-Imageable Dielectric
ISO
— International Organization for Standardization
LCD
— Liquid Crystal Display
EDI
— Electronic Data Interchange
IP
— Internet Protocol
AC
— Alternating Current
FET
— Field Effect Transistor
DBMS
— Database Management System
BOD
— Biochemical Oxygen Demand
ABS
— Acrylonitrile, Butadiene, and Styrene
PPM
— parts per million
TQM
— Total Quality Management
RFP
— Request For Proposal
SMOBC
— Solder Mask Over Bare Copper
HTTP
— Hypertext Transfer Protocol
ROM
— Rough Order of Magnitude
ASME
— American Society of Mechanical Engineers
RFS
— Regardless of Feature Size
MMIC
— Monolithic Microwave Integrated Circuit
MSDS
— Material Safety Data Sheets
EMP
— Electromagnetic Pulse
ASTM
— American Society for Testing and Materials (Philadelphia, Pennsylvania)
ATR
— Air Transport Rack
ENIPIG
— Electroless Nickel Immersion Palladium Immersion Gold
CAE
— Computer-Aided Engineering
PCB
— printed circuit board
FAA
— Federal Aviation Administration
ASCII
— American National Standard Code for Information Interchange
EPA
— Environmental Protection Agency (US)
URL
— Universal Resource Locator
MTBF
— Mean Time Before Failure
NC
— Numerical Control
NPI
— New Product Introduction
RAM
— random-access memory
TTL
— Transistor-Transistor Logic
I/O
— Input/Output
IC
— Integrated Circuit
CFM
— Cubic Feet per Minute
PDL
— Page Description Language
FFT
— Fast Fourier Transform
PLD
— Programmable Logic Device
CRT
— Cathode Ray Tube (type of TV)
PVC
— Polyvinyl Chloride
MOS
— Model Output Statistics
DC
— Direct Current
CTE
— Coefficient of Thermal Expansion
AGC
— Automatic Gain Control
P&IA
— Packaging And Interconnecting Assembly
ECR
— Engineering Change Request
OSI
— Open Systems Interconnection (iso Standard)
PGA
— Pin Grid Array
RFQ
— Request For Quote
DOD
— United States Department of Defense
NSA
— National Security Agency
BOM
— Bill of Material
CSP
— Chip Scale Package
RPM
— Revolutions Per Minute, (Rotations Per Minute)
MTTR
— Mean Time To Repair
MAP
— Manufacturing Automation Protocol
FC-PBGA
— Flip Chip Platic Ball Grid Array
ECO
— Engineering Change Order
DMA
— direct memory access (computer term)
SQL
— Structured Query Language
AQL
— Acceptable Quality Level
IEC
— International Electrotechnical Commission
BITE
— Built-In Test Equipment
PC
— Personal computer (host)
AEC
— Architecture, Engineering, Construction
PLCC
— Plastic Leaded Chip Carrier (electronics)
ESD
— Electrostatic Discharge
WYSIWYG
— What You See Is What You Get (pronounced Wizzy-wig. See Entry For Derived Acronyms)
IR
— Infrared
MAC
— Media Access Control
ECC
— Error Correction Code (Error Checking And Correction)
WIP
— Work in Process
P&IS
— Packaging And Interconnecting Structure
EMC
— Electromagnetic Compatibility
PSI
— Pounds Per Square Inch (Static Pressure)
PBX
— Private Branch eXchange (company phone system)
FCC
— Federal Communications Commission (US)
DRC
— Design Rule Check
DOE
— Design Of Experiment
BGA
— Ball Grid Array [electronic Packaging]
DLA
— U.S. Defense Logistics Agency
CRC
— Contrôle de Redondance Cyclique (French: Cyclic Redundancy Check)
SAE
— Society of Automotive Engineers
NEMA
— National Electric Manufacturer's Association
MSI
— Medium-Scale Integration
MMC
— Maximum Material Condition
IEEE
— Institute of Electrical and Electronic Engineers, Inc.
ECN
— Engineering Change Notice
DSP
— Digital Signal Processor
NBS
— National Bureau of Standards (US)
RPM
— Resale Price Maintenance. The UK Net Book Agreement, as was. Means by which retail prices are controlled by primary suppliers. (Alternatively, Revolutions Per Minute, as in engine speed and 78, 33 and 45 records. In years to come how many people will know
ARINC
— Aeronautical Radio Incorporated
SFM
— Surface Feet per Minute
CNC
— Computer Numerical Control
PPS
— Polyphenylene Sulfide
TCR
— Temperature Coefficient of Resistance
AWG
— American Wire Gauge
FC-CBGA
— Flip Chip Ceramic Ball Grid Array
LRU
— Lowest Replaceable Unit
NASA
— National Aeronautics and Space Administration (US)
TFE
— Tetrafluoroethylene
FPGA
— Field-Programmable Gate Array
CAD
— Computer-Aided Design
CDA
— Copper Development Association Inc.
T&C
— Terms & Conditions
RMS
— root mean square (preferred over "RMS")
MDA
— Methylenedianiline
SPC
— Statistical Process Control. Forerunning quality theory from the 1960s to TQC and TQM.
JIT
— Just-In-Time (inventory management)
ASQ
— Alpha System Qualification
VOC
— Volatile Organic Compounds (air pollution)
ENIG
— Electroless Nickel Immersion Gold
PCMCIA
— Personal Computer Memory Card International Association
C&E
— Cause and Effect
SQC
— Statistical Quality Control
NDT
— Nondestructive Test
TCE
— Thermal Coefficient of Expansion
IPM
— Inches Per Minute
LBA
— Logical Block Addresses
DVM
— Digital Voltmeter
TP
— True Position
SIR
— Surface Insulation Resistance
SMEMA
— Surface Mount Equipment Manufacturers Association
ESR
— Equivalent Series Resistance
DCMA
— Defense Contract Management Agency
OLB
— Outer-Lead Bonding
PCA
— Printed Circuit Assembly
CAGE
— Commercial and Government Entity
AOQ
— Average Outgoing Quality
LCCC
— Leadless Ceramic Chip Carrier
EIA
— Electronics Industry Association (Adelaide, South Australia, Australia)
RISC
— Reduced Instruction Set Computing
TG
— Glass Transition Temperature
TIFF
— Tag Image File Format
GTA
— Gas Tungsten Arc
EDO
— Extended Data Output
LPISM
— Liquid Photo-Imageable Solder Mask
QPL
— qualified products list
LSI
— Large Scale Integration -> VLSI
MAC
— Maximum Allowable Concentration
DXF
— Data Exchange Format
ESI
— Early Supplier Involvement
UPH
— Unit Per Hour
SERA
— Sequential Electrochemical Reduction Analysis
UBM
— Under Bump Metallization
MRP II
— manufacturing resource planning
KGB
— Known Good Board
GMA
— Gas Metal Arc
MA
— Mechanical Advantage
MITI
— Ministry of International Trade and Industry
CET
— Certified Electronic Technician
CPLD
— Complex Programmable Logic Device
CAM
— Computer-Aided Manufacturing
TDR
— Time-Domain Reflectometry
PTFE
— Polytetrafluoroethylene
ENEPIG
— Electroless Nickel Electroless Palladium Immersion Gold
SEM
— Scanning Electron Microscopes
FAR
— Failure Analysis Report
KGD
— Known Good Die
DK
— Dielectric Constant
CITIS
— Contractor Integrated Technical Information Service
MRP
— Material Requirement Planning
UHF
— Ultrahigh Frequency
SMD
— Surface Mount Device
DCAS
— Defense Contract Administration Services
CASE
— Computer-Aided Software Engineering
EDIF
— Electronic Design Interchange Format
EMF
— Electro-Motive Force
PB
— Printed Board
CISC
— Complex Instruction Set Computing
EDA
— Electronic Design Automation
ED
— Electrodeposited
SSI
— Small-Scale Integration
LIF
— Low Insertion Force
FEP
— fluorinated ethylene-propylene
CBGA
— Ceramic Ball Grid Array
MCAE
— Mechanical Computer-Aided Engineering
FSCM
— Federal Stock Code for Manufacturers
APT
— Automatically Programmed Tools
PPO
— PolyPhenylene Oxide
DOD
— Dissolved Oxygen Demand
TOP
— Technical And Office Protocol
CALS
— Computer-aided Acquisition and Logistic Support
ICAM
— integrated computer-aided manufacturing
EIS
— Engineering Information System
SIP
— Single Inline Package
DNC
— Distributed Numerical Control
MEK
— Methylethyl Ketone
SEM
— standard electronic module
VAR
— Value-Added Reseller
AXI
— Automated X-Ray Inspection
MLB
— Multilayer Board
DESC
— Defense Electronics Supply Center
PIP
— Pin-In-Paste Technology
RTV
— Room Temperature Vulcanizer
PVT
— Production Validation Test
CFM
— Continuous Flow Manufacturing
ZIP
— zigzag inline package
PBGA
— Plastic Ball Grid Array
QTA
— Quick Turn Around
VHF
— Very-High Frequency
ZAF
— Z-Axis Adhesive Film
MELF
— Metal Electrode Face
LGA
— Lang Grid Array
AGV
— Automated Guided Vehicle
RETMA
— Radio Electronics & Television Manufacturers Association
CMC
— Copper Moly Copper
AA
— Antenna Array
PDES
— Product Data Exchange Specification
PWA
— Printed Wiring Assembly
DTP
— Diameter True Position
AGR
— Annual Average Growth Rate
NBR
— Nitrile Butadiene-Acrylonitrile Rubber
GAAS
— Gallium Arsenide Application Symposium
IEDR
— Initial Engineering Design Review
SOIC
— Small-Outline Integrated Circuit
SMTA
— Surface Mount Technology Association
ECAD
— Electronic Computer-Aided Design
VHDL
— Vhsic Hardware Description Language
GTPBGA
— Glob Top Plastic Ball Grid Array
QFP
— Quad Flatpack Package
ILB
— Inner-Lead Bonding
ISHM
— International Society For Hybrid Microelectronics
DIP
— Dual-Inline Package
ISCET
— International Society of Certified Electronics Technicians
FMEA
— Fault Mode And Effect Analysis
CAT
— Computer-Aided Testing
GBIB
— General Purpose Interface Bus
QML
— Qualified Manufacturer's List
AOI
— Automated Optical Inspection
CAFM
— Computer-Aided Facilities Management
DCMC
— Defense Contract Management Command
DRM
— Drawing Requirements Manual
ELD
— Electro-Luminescent Diode
DMS
— Dynamic Mechanical Spectroscopy
BC
— Buried Capacitance
COB
— Chip-On-Board
AVT
— Accelerated Vesication Test
THT
— Through-Hole Technology
C3
— Command,Control And Communicate
LMC
— Least Material Condition
DTS
— Dock to Stock
ODR
— Oscillating Disk Rheometer
XIP
— Execute In Place
CMOS
— cargo movement operations system; complimentary metal-oxide semiconductor
DATC
— Design Automation Technical Committee (IEEE)
PRT
— Planar Resistor Technology
DMSA
— Defense Manufacturers And Suppliers Association
DFM
— Design For Manufacture
ZIF
— Zero-Insertion Force
CVS
— Cyclic Voltammetry Stripping
R&R
— Repeatability and Reproducibility
FPT
— Fine-Pitch Technology
ETPC
— Electrolytic Tough-Pitch Copper
ACA
— Anisotropically Conductive Adhesive
IEPS
— International Electronic Packaging Society
VLSI
— Very-Large Scale Integration
OFHC
— Oxygen-Free High-Conductivity Copper
BDMA
— Benzyldimethylamine
AIS
— Adhesive Interconnect System
HPGL
— Hewlett Packard Graphic Language
ACCU
— Alternating Current Connection Unit
SPICE
— Simulation Program Integrated Circuit Emphasis
ECL
— Emitter-Coupled Logic
OSP
— Organic Solder Preservative
CPU
— Capability Performance Upper
FEM
— Finite-Element Modeling
VSAG
— Vhdl Standardization and Analysis Group
CAPP
— Computer-Aided Process Planning
COD
— Consumed Oxygen Demand
NECQ
— National Electronics Component Qualification System
LTCC
— Low Temperature Co-fired Ceramic
VME
— Versa-Module Electronic
ASPARC
— Ability of Solder Paste to Retain Components
NADCAP
— National Aerospace and Defense Contractors Accreditation Procedures
HASL
— Hot Air Solder Leveler
STEP
— Standard For Exchange Of Product Model Data
TFA
— Tree-Based Floorplanning Algorithm
C4
— Controlled Collapse Component Connection
CSA
— Canadian Standards Agency
ECCB
— Electronic Components Certification Board
NIST
— National Institute For Science And Technology
AA
— Automatic Acknowledge
OA
— Organic Acid
FEA
— Finite-Element Analysis
FCT
— Functional Circuit Test
RA
— Rosin-Activated
COT
— Configure To Order
MCAD
— Mechanical Computer Aided Design
MLPWB
— Multilayer Printed Wiring Board
DIN
— Deutsches Institute for Normung
PHIGS
— Programmer's Hierarchical Interface Graphics Standard
RMA
— Rosin Mildy Activated
VHSIC
— Very-High Speed Integrated Circuits
FCC
— Flat-Conductor Cable
ITT
— Inter-Test Time
EMPF
— Electronics Manufacturing Productivity Facility
PTH
— Plated-Through Hole
WSI
— Wafer-Scale Integration
MATS
— Material Transport Segment
R
— Rosin
ULSI
— Ultra-Large Scale Integration
IGES
— Integrated Graphics Exchange System
TGA
— Thermo Gravimetric Analysis
HTE
— High Temperature Elongation
TAB
— Tape-Automated Bonding
BOT
— Build To Order
CCAPS
— Circuit Card Assembly And Processing System
MCM
— multichip module
AC
— All Call
EMS
— Electrical Manufacturing Services
TO
— Transistor Outline
SMT
— Surface Mounting Technology
SEC
— Solvent Extract Conductivity
SOS
— Silicon-On-Sapphire
EPT
— Ethylene-Propylene Terepolymer
OSHA
— Occupational Safety Hazards Act
NMR
— Normal-Mode Rejection
PT
— Positional tolerance
JEDEC
— Solid State Technology Association
EPR
— Ethylene-propylene Resin
LDA
— Logic Design Automation
CSG
— Constructive Solids Geometry
RFI
— Radio-Frequency Interference
ATG
— Automatic Test Generation
DAB
— Designated Audit Body
CIM
— computer-integrated manufacturing
BTAB
— Bumped Tape-Automated Bonding
ICA
— Isotropically Conductive Adhesive
PP
— Process Performance
RWOH
— Reliability Without Hermeticity
ICT
— Inner Circuit Test
CM
— Contract Manufacturer
MIR
— Moisture Insulation Resistance
IDC
— Insulation-Displacement Connection
CAF
— Cathotic Anionic Filaments
MIBK
— Methyl-Isobutyl Ketone
CPL
— Capability Performance, Lower
PEM
— Plastic Electronic Module
EDM
— Electro-Discharge Machining
TMA
— Thermo Mechanical Analysis
CAR
— Computer-Aided Repair
ACC
— Advanced Concept Construction Active Control Channel
DOS
— Disc Operating System
DIM
— Data-Information Record
CEPM
— Certified Ems Program Managers
RTS
— Ramp To Spike
DS
— Double-Sided
IECQ
— International Electronic Component Qualification System
CP
— Capability Performance
SBU
— Sequential Buildup
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