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>> Industry Abbreviations
Look through 366 acronyms and abbreviations related to Industry:
LAN
— Local Area Network
URL
— Universal Resource Locator
ROM
— Read-Only Memory
FTP
— File Transfer Protocol
ANOVA
— Analysis of Variance (statistics)
ANSI
— American National Standards Institute, Inc.
RSS
— Ramp Soak Spike
LED
— Light-Emitting Diode
OEM
— Original Equipment Manufacturer (usually in reference to car parts)
CPU
— Central Processing Unit
EPA
— Environmental Protection Agency (US)
PPM
— parts per million
ROM
— Rough Order of Magnitude
BT
— Bismaleimide Triazine
IP
— Internet Protocol
PID
— Photo-Imageable Dielectric
ISO
— International Organization for Standardization
EDI
— Electronic Data Interchange
P&IA
— Packaging And Interconnecting Assembly
ASTM
— American Society for Testing and Materials (Philadelphia, Pennsylvania)
RFP
— Request For Proposal
LCD
— Liquid Crystal Display
DSC
— Differential Scanning Calorimetry
FET
— Field Effect Transistor
MSDS
— Material Safety Data Sheets
AC
— Alternating Current
WWW
— World Wide Web
P&IS
— Packaging And Interconnecting Structure
TQM
— Total Quality Management
ASCII
— American National Standard Code for Information Interchange
SMOBC
— Solder Mask Over Bare Copper
MTBF
— Mean Time Before Failure
ASME
— American Society of Mechanical Engineers
HTTP
— Hypertext Transfer Protocol
DBMS
— Database Management System
PCB
— printed circuit board
NPI
— New Product Introduction
CAE
— Computer-Aided Engineering
RPM
— Revolutions Per Minute, (Rotations Per Minute)
RAM
— random-access memory
CFM
— Cubic Feet per Minute
FAA
— Federal Aviation Administration
CRT
— Cathode Ray Tube (type of TV)
DOD
— United States Department of Defense
ECR
— Engineering Change Request
RFS
— Regardless of Feature Size
BOD
— Biochemical Oxygen Demand
ENIPIG
— Electroless Nickel Immersion Palladium Immersion Gold
MMIC
— Monolithic Microwave Integrated Circuit
ABS
— Acrylonitrile, Butadiene, and Styrene
MTTR
— Mean Time To Repair
AGC
— Automatic Gain Control
NC
— Numerical Control
EMP
— Electromagnetic Pulse
ECO
— Engineering Change Order
WIP
— Work in Process
DC
— Direct Current
FFT
— Fast Fourier Transform
ATR
— Air Transport Rack
PC
— Personal computer (host)
TTL
— Transistor-Transistor Logic
AQL
— Acceptable Quality Level
BOM
— Bill of Material
MAP
— Manufacturing Automation Protocol
PVC
— Polyvinyl Chloride
IC
— Integrated Circuit
ECN
— Engineering Change Notice
RPM
— Resale Price Maintenance. The UK Net Book Agreement, as was. Means by which retail prices are controlled by primary suppliers. (Alternatively, Revolutions Per Minute, as in engine speed and 78, 33 and 45 records. In years to come how many people will know
SQL
— Structured Query Language
I/O
— Input/Output
RFQ
— Request For Quote
PSI
— Pounds Per Square Inch (Static Pressure)
FCC
— Federal Communications Commission (US)
WYSIWYG
— What You See Is What You Get (pronounced Wizzy-wig. See Entry For Derived Acronyms)
ECC
— Error Correction Code (Error Checking And Correction)
OSI
— Open Systems Interconnection (iso Standard)
CRC
— Contrôle de Redondance Cyclique (French: Cyclic Redundancy Check)
NSA
— National Security Agency
AEC
— Architecture, Engineering, Construction
PLD
— Programmable Logic Device
FC-PBGA
— Flip Chip Platic Ball Grid Array
NEMA
— National Electric Manufacturer's Association
AWG
— American Wire Gauge
DLA
— U.S. Defense Logistics Agency
PDL
— Page Description Language
ESD
— Electrostatic Discharge
SAE
— Society of Automotive Engineers
SPC
— Statistical Process Control. Forerunning quality theory from the 1960s to TQC and TQM.
IEEE
— Institute of Electrical and Electronic Engineers, Inc.
BITE
— Built-In Test Equipment
PLCC
— Plastic Leaded Chip Carrier (electronics)
MOS
— Model Output Statistics
DMA
— direct memory access (computer term)
DOE
— Design Of Experiment
T&C
— Terms & Conditions
IR
— Infrared
PBX
— Private Branch eXchange (company phone system)
CNC
— Computer Numerical Control
CSP
— Chip Scale Package
DSP
— Digital Signal Processor
IEC
— International Electrotechnical Commission
SFM
— Surface Feet per Minute
PGA
— Pin Grid Array
MRP II
— manufacturing resource planning
NBS
— National Bureau of Standards (US)
RMS
— root mean square (preferred over "RMS")
CTE
— Coefficient of Thermal Expansion
EMC
— Electromagnetic Compatibility
SQC
— Statistical Quality Control
ASQ
— Alpha System Qualification
MAC
— Media Access Control
CAD
— Computer-Aided Design
MSI
— Medium-Scale Integration
CAGE
— Commercial and Government Entity
C&E
— Cause and Effect
DRC
— Design Rule Check
PCMCIA
— Personal Computer Memory Card International Association
VOC
— Volatile Organic Compounds (air pollution)
ARINC
— Aeronautical Radio Incorporated
QPL
— qualified products list
BGA
— Ball Grid Array [electronic Packaging]
NDT
— Nondestructive Test
NASA
— National Aeronautics and Space Administration (US)
PPS
— Polyphenylene Sulfide
MMC
— Maximum Material Condition
ENIG
— Electroless Nickel Immersion Gold
OLB
— Outer-Lead Bonding
TCR
— Temperature Coefficient of Resistance
JIT
— Just-In-Time (inventory management)
UBM
— Under Bump Metallization
FC-CBGA
— Flip Chip Ceramic Ball Grid Array
MDA
— Methylenedianiline
TFE
— Tetrafluoroethylene
FPGA
— Field-Programmable Gate Array
DVM
— Digital Voltmeter
PTFE
— Polytetrafluoroethylene
LRU
— Lowest Replaceable Unit
RISC
— Reduced Instruction Set Computing
CDA
— Copper Development Association Inc.
LBA
— Logical Block Addresses
LSI
— Large Scale Integration -> VLSI
DCMA
— Defense Contract Management Agency
TIFF
— Tag Image File Format
AOQ
— Average Outgoing Quality
UPH
— Unit Per Hour
MRP
— Material Requirement Planning
EIA
— Electronics Industry Association (Adelaide, South Australia, Australia)
TP
— True Position
EDO
— Extended Data Output
PCA
— Printed Circuit Assembly
IPM
— Inches Per Minute
ESI
— Early Supplier Involvement
MITI
— Ministry of International Trade and Industry
CAM
— Computer-Aided Manufacturing
SERA
— Sequential Electrochemical Reduction Analysis
TDR
— Time-Domain Reflectometry
DXF
— Data Exchange Format
KGB
— Known Good Board
PIP
— Pin-In-Paste Technology
CASE
— Computer-Aided Software Engineering
TG
— Glass Transition Temperature
CPLD
— Complex Programmable Logic Device
LCCC
— Leadless Ceramic Chip Carrier
ENEPIG
— Electroless Nickel Electroless Palladium Immersion Gold
ESR
— Equivalent Series Resistance
SEM
— Scanning Electron Microscopes
TCE
— Thermal Coefficient of Expansion
SMEMA
— Surface Mount Equipment Manufacturers Association
SIR
— Surface Insulation Resistance
CITIS
— Contractor Integrated Technical Information Service
DCAS
— Defense Contract Administration Services
KGD
— Known Good Die
EDA
— Electronic Design Automation
GTA
— Gas Tungsten Arc
UHF
— Ultrahigh Frequency
MAC
— Maximum Allowable Concentration
EDIF
— Electronic Design Interchange Format
LPISM
— Liquid Photo-Imageable Solder Mask
CISC
— Complex Instruction Set Computing
GMA
— Gas Metal Arc
FEP
— fluorinated ethylene-propylene
LIF
— Low Insertion Force
PVT
— Production Validation Test
CET
— Certified Electronic Technician
TOP
— Technical And Office Protocol
RTV
— Room Temperature Vulcanizer
DESC
— Defense Electronics Supply Center
CAT
— Computer-Aided Testing
MA
— Mechanical Advantage
SSI
— Small-Scale Integration
DK
— Dielectric Constant
FAR
— Failure Analysis Report
PPO
— PolyPhenylene Oxide
APT
— Automatically Programmed Tools
VAR
— Value-Added Reseller
DTS
— Dock to Stock
ILB
— Inner-Lead Bonding
SPICE
— Simulation Program Integrated Circuit Emphasis
MEK
— Methylethyl Ketone
SMD
— Surface Mount Device
CALS
— Computer-aided Acquisition and Logistic Support
MCAE
— Mechanical Computer-Aided Engineering
CBGA
— Ceramic Ball Grid Array
ICAM
— integrated computer-aided manufacturing
DNC
— Distributed Numerical Control
PB
— Printed Board
FSCM
— Federal Stock Code for Manufacturers
EIS
— Engineering Information System
DOD
— Dissolved Oxygen Demand
MLB
— Multilayer Board
ED
— Electrodeposited
EMF
— Electro-Motive Force
CFM
— Continuous Flow Manufacturing
CMC
— Copper Moly Copper
ZIP
— zigzag inline package
ZAF
— Z-Axis Adhesive Film
SEM
— standard electronic module
AXI
— Automated X-Ray Inspection
PBGA
— Plastic Ball Grid Array
VHF
— Very-High Frequency
AGV
— Automated Guided Vehicle
SIP
— Single Inline Package
ECAD
— Electronic Computer-Aided Design
QTA
— Quick Turn Around
ACCU
— Alternating Current Connection Unit
CAFM
— Computer-Aided Facilities Management
AA
— Antenna Array
PDES
— Product Data Exchange Specification
RETMA
— Radio Electronics & Television Manufacturers Association
AVT
— Accelerated Vesication Test
DCMC
— Defense Contract Management Command
SMTA
— Surface Mount Technology Association
DTP
— Diameter True Position
GAAS
— Gallium Arsenide Application Symposium
ISHM
— International Society For Hybrid Microelectronics
THT
— Through-Hole Technology
CVS
— Cyclic Voltammetry Stripping
PWA
— Printed Wiring Assembly
XIP
— Execute In Place
DIP
— Dual-Inline Package
EMS
— Electrical Manufacturing Services
MELF
— Metal Electrode Face
FMEA
— Fault Mode And Effect Analysis
LGA
— Lang Grid Array
SOIC
— Small-Outline Integrated Circuit
ACA
— Anisotropically Conductive Adhesive
AGR
— Annual Average Growth Rate
NBR
— Nitrile Butadiene-Acrylonitrile Rubber
QFP
— Quad Flatpack Package
ZIF
— Zero-Insertion Force
VHDL
— Vhsic Hardware Description Language
DRM
— Drawing Requirements Manual
R&R
— Repeatability and Reproducibility
CAPP
— Computer-Aided Process Planning
ETPC
— Electrolytic Tough-Pitch Copper
IEDR
— Initial Engineering Design Review
QML
— Qualified Manufacturer's List
GTPBGA
— Glob Top Plastic Ball Grid Array
DMS
— Dynamic Mechanical Spectroscopy
AIS
— Adhesive Interconnect System
EMPF
— Electronics Manufacturing Productivity Facility
CPU
— Capability Performance Upper
COD
— Consumed Oxygen Demand
BDMA
— Benzyldimethylamine
CMOS
— cargo movement operations system; complimentary metal-oxide semiconductor
ITT
— Inter-Test Time
ASPARC
— Ability of Solder Paste to Retain Components
PRT
— Planar Resistor Technology
HPGL
— Hewlett Packard Graphic Language
IEPS
— International Electronic Packaging Society
COB
— Chip-On-Board
BC
— Buried Capacitance
ISCET
— International Society of Certified Electronics Technicians
ECCB
— Electronic Components Certification Board
DATC
— Design Automation Technical Committee (IEEE)
VHSIC
— Very-High Speed Integrated Circuits
OFHC
— Oxygen-Free High-Conductivity Copper
C4
— Controlled Collapse Component Connection
ODR
— Oscillating Disk Rheometer
TGA
— Thermo Gravimetric Analysis
GBIB
— General Purpose Interface Bus
ELD
— Electro-Luminescent Diode
VLSI
— Very-Large Scale Integration
LMC
— Least Material Condition
DMSA
— Defense Manufacturers And Suppliers Association
SMT
— Surface Mounting Technology
FPT
— Fine-Pitch Technology
DAB
— Designated Audit Body
AOI
— Automated Optical Inspection
STEP
— Standard For Exchange Of Product Model Data
TFA
— Tree-Based Floorplanning Algorithm
C3
— Command,Control And Communicate
DFM
— Design For Manufacture
TO
— Transistor Outline
FEA
— Finite-Element Analysis
ECL
— Emitter-Coupled Logic
TMA
— Thermo Mechanical Analysis
AA
— Automatic Acknowledge
RA
— Rosin-Activated
OA
— Organic Acid
FEM
— Finite-Element Modeling
CSA
— Canadian Standards Agency
ATG
— Automatic Test Generation
NECQ
— National Electronics Component Qualification System
OSP
— Organic Solder Preservative
NIST
— National Institute For Science And Technology
FCC
— Flat-Conductor Cable
NADCAP
— National Aerospace and Defense Contractors Accreditation Procedures
HASL
— Hot Air Solder Leveler
RFI
— Radio-Frequency Interference
RWOH
— Reliability Without Hermeticity
COT
— Configure To Order
VSAG
— Vhdl Standardization and Analysis Group
IGES
— Integrated Graphics Exchange System
LTCC
— Low Temperature Co-fired Ceramic
VME
— Versa-Module Electronic
MCAD
— Mechanical Computer Aided Design
CAF
— Cathotic Anionic Filaments
SOS
— Silicon-On-Sapphire
CCAPS
— Circuit Card Assembly And Processing System
PHIGS
— Programmer's Hierarchical Interface Graphics Standard
RMA
— Rosin Mildy Activated
TAB
— Tape-Automated Bonding
FCT
— Functional Circuit Test
EPT
— Ethylene-Propylene Terepolymer
HTE
— High Temperature Elongation
CAR
— Computer-Aided Repair
PTH
— Plated-Through Hole
R
— Rosin
DIN
— Deutsches Institute for Normung
CP
— Capability Performance
MIBK
— Methyl-Isobutyl Ketone
MLPWB
— Multilayer Printed Wiring Board
IECQ
— International Electronic Component Qualification System
BTAB
— Bumped Tape-Automated Bonding
PT
— Positional tolerance
WSI
— Wafer-Scale Integration
DOS
— Disc Operating System
LDA
— Logic Design Automation
BOT
— Build To Order
CEPM
— Certified Ems Program Managers
DIM
— Data-Information Record
NMR
— Normal-Mode Rejection
AC
— All Call
MATS
— Material Transport Segment
SBU
— Sequential Buildup
IDC
— Insulation-Displacement Connection
CPL
— Capability Performance, Lower
ULSI
— Ultra-Large Scale Integration
SEC
— Solvent Extract Conductivity
EDM
— Electro-Discharge Machining
CIM
— computer-integrated manufacturing
MCM
— multichip module
PP
— Process Performance
DS
— Double-Sided
CSG
— Constructive Solids Geometry
PEM
— Plastic Electronic Module
OSHA
— Occupational Safety Hazards Act
JEDEC
— Solid State Technology Association
ICA
— Isotropically Conductive Adhesive
ACC
— Advanced Concept Construction Active Control Channel
ICT
— Inner Circuit Test
CM
— Contract Manufacturer
MIR
— Moisture Insulation Resistance
EPR
— Ethylene-propylene Resin
RTS
— Ramp To Spike
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