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>> Industry Abbreviations
Look through 366 acronyms and abbreviations related to Industry:
LAN
— Local Area Network
ANOVA
— Analysis of Variance (statistics)
BT
— Bismaleimide Triazine
FTP
— File Transfer Protocol
ROM
— Read-Only Memory
CPU
— Central Processing Unit
LED
— Light-Emitting Diode
WWW
— World Wide Web
ANSI
— American National Standards Institute, Inc.
PID
— Photo-Imageable Dielectric
ISO
— International Organization for Standardization
OEM
— Original Equipment Manufacturer (usually in reference to car parts)
LCD
— Liquid Crystal Display
DBMS
— Database Management System
EDI
— Electronic Data Interchange
AC
— Alternating Current
FET
— Field Effect Transistor
BOD
— Biochemical Oxygen Demand
ABS
— Acrylonitrile, Butadiene, and Styrene
DSC
— Differential Scanning Calorimetry
IP
— Internet Protocol
RSS
— Ramp Soak Spike
RFS
— Regardless of Feature Size
HTTP
— Hypertext Transfer Protocol
SMOBC
— Solder Mask Over Bare Copper
MMIC
— Monolithic Microwave Integrated Circuit
TQM
— Total Quality Management
ATR
— Air Transport Rack
RFP
— Request For Proposal
EMP
— Electromagnetic Pulse
ASME
— American Society of Mechanical Engineers
ENIPIG
— Electroless Nickel Immersion Palladium Immersion Gold
MSDS
— Material Safety Data Sheets
CAE
— Computer-Aided Engineering
PPM
— parts per million
NPI
— New Product Introduction
PCB
— printed circuit board
FAA
— Federal Aviation Administration
NC
— Numerical Control
ROM
— Rough Order of Magnitude
ASTM
— American Society for Testing and Materials (Philadelphia, Pennsylvania)
TTL
— Transistor-Transistor Logic
I/O
— Input/Output
MTBF
— Mean Time Before Failure
IC
— Integrated Circuit
MOS
— Model Output Statistics
ASCII
— American National Standard Code for Information Interchange
EPA
— Environmental Protection Agency (US)
PDL
— Page Description Language
PLD
— Programmable Logic Device
CTE
— Coefficient of Thermal Expansion
FFT
— Fast Fourier Transform
CFM
— Cubic Feet per Minute
URL
— Universal Resource Locator
RAM
— random-access memory
DC
— Direct Current
PVC
— Polyvinyl Chloride
PGA
— Pin Grid Array
AGC
— Automatic Gain Control
RFQ
— Request For Quote
NSA
— National Security Agency
OSI
— Open Systems Interconnection (iso Standard)
CRT
— Cathode Ray Tube (type of TV)
P&IA
— Packaging And Interconnecting Assembly
CSP
— Chip Scale Package
ECR
— Engineering Change Request
BOM
— Bill of Material
DOD
— United States Department of Defense
BITE
— Built-In Test Equipment
FC-PBGA
— Flip Chip Platic Ball Grid Array
MAP
— Manufacturing Automation Protocol
MTTR
— Mean Time To Repair
IEC
— International Electrotechnical Commission
SQL
— Structured Query Language
DMA
— direct memory access (computer term)
AEC
— Architecture, Engineering, Construction
DRC
— Design Rule Check
ECO
— Engineering Change Order
IR
— Infrared
WYSIWYG
— What You See Is What You Get (pronounced Wizzy-wig. See Entry For Derived Acronyms)
PC
— Personal computer (host)
ESD
— Electrostatic Discharge
AQL
— Acceptable Quality Level
RPM
— Revolutions Per Minute, (Rotations Per Minute)
MMC
— Maximum Material Condition
PLCC
— Plastic Leaded Chip Carrier (electronics)
ECC
— Error Correction Code (Error Checking And Correction)
MAC
— Media Access Control
PPS
— Polyphenylene Sulfide
DOE
— Design Of Experiment
CRC
— Contrôle de Redondance Cyclique (French: Cyclic Redundancy Check)
WIP
— Work in Process
TCR
— Temperature Coefficient of Resistance
EMC
— Electromagnetic Compatibility
P&IS
— Packaging And Interconnecting Structure
BGA
— Ball Grid Array [electronic Packaging]
DSP
— Digital Signal Processor
TFE
— Tetrafluoroethylene
PBX
— Private Branch eXchange (company phone system)
SAE
— Society of Automotive Engineers
MSI
— Medium-Scale Integration
IEEE
— Institute of Electrical and Electronic Engineers, Inc.
CDA
— Copper Development Association Inc.
FCC
— Federal Communications Commission (US)
LRU
— Lowest Replaceable Unit
DLA
— U.S. Defense Logistics Agency
NBS
— National Bureau of Standards (US)
TCE
— Thermal Coefficient of Expansion
PSI
— Pounds Per Square Inch (Static Pressure)
NEMA
— National Electric Manufacturer's Association
ARINC
— Aeronautical Radio Incorporated
FC-CBGA
— Flip Chip Ceramic Ball Grid Array
ECN
— Engineering Change Notice
RPM
— Resale Price Maintenance. The UK Net Book Agreement, as was. Means by which retail prices are controlled by primary suppliers. (Alternatively, Revolutions Per Minute, as in engine speed and 78, 33 and 45 records. In years to come how many people will know
AWG
— American Wire Gauge
IPM
— Inches Per Minute
NASA
— National Aeronautics and Space Administration (US)
ENIG
— Electroless Nickel Immersion Gold
MDA
— Methylenedianiline
FPGA
— Field-Programmable Gate Array
TP
— True Position
SIR
— Surface Insulation Resistance
DVM
— Digital Voltmeter
ESR
— Equivalent Series Resistance
TG
— Glass Transition Temperature
RMS
— root mean square (preferred over "RMS")
VOC
— Volatile Organic Compounds (air pollution)
CNC
— Computer Numerical Control
LCCC
— Leadless Ceramic Chip Carrier
PCA
— Printed Circuit Assembly
T&C
— Terms & Conditions
DCMA
— Defense Contract Management Agency
SFM
— Surface Feet per Minute
LBA
— Logical Block Addresses
CAD
— Computer-Aided Design
GTA
— Gas Tungsten Arc
AOQ
— Average Outgoing Quality
SMEMA
— Surface Mount Equipment Manufacturers Association
NDT
— Nondestructive Test
LPISM
— Liquid Photo-Imageable Solder Mask
JIT
— Just-In-Time (inventory management)
C&E
— Cause and Effect
SPC
— Statistical Process Control. Forerunning quality theory from the 1960s to TQC and TQM.
PCMCIA
— Personal Computer Memory Card International Association
GMA
— Gas Metal Arc
MAC
— Maximum Allowable Concentration
MA
— Mechanical Advantage
ASQ
— Alpha System Qualification
SQC
— Statistical Quality Control
ESI
— Early Supplier Involvement
RISC
— Reduced Instruction Set Computing
CAGE
— Commercial and Government Entity
UBM
— Under Bump Metallization
EIA
— Electronics Industry Association (Adelaide, South Australia, Australia)
TIFF
— Tag Image File Format
QPL
— qualified products list
CET
— Certified Electronic Technician
EDO
— Extended Data Output
DK
— Dielectric Constant
MITI
— Ministry of International Trade and Industry
DXF
— Data Exchange Format
LSI
— Large Scale Integration -> VLSI
KGB
— Known Good Board
TDR
— Time-Domain Reflectometry
FAR
— Failure Analysis Report
EMF
— Electro-Motive Force
OLB
— Outer-Lead Bonding
ED
— Electrodeposited
UPH
— Unit Per Hour
SEM
— Scanning Electron Microscopes
SMD
— Surface Mount Device
CPLD
— Complex Programmable Logic Device
PTFE
— Polytetrafluoroethylene
MRP
— Material Requirement Planning
PB
— Printed Board
DCAS
— Defense Contract Administration Services
CAM
— Computer-Aided Manufacturing
CISC
— Complex Instruction Set Computing
EDA
— Electronic Design Automation
CITIS
— Contractor Integrated Technical Information Service
EDIF
— Electronic Design Interchange Format
MRP II
— manufacturing resource planning
CASE
— Computer-Aided Software Engineering
DOD
— Dissolved Oxygen Demand
UHF
— Ultrahigh Frequency
KGD
— Known Good Die
SERA
— Sequential Electrochemical Reduction Analysis
SSI
— Small-Scale Integration
FEP
— fluorinated ethylene-propylene
SIP
— Single Inline Package
SEM
— standard electronic module
EIS
— Engineering Information System
LIF
— Low Insertion Force
DNC
— Distributed Numerical Control
APT
— Automatically Programmed Tools
AXI
— Automated X-Ray Inspection
PPO
— PolyPhenylene Oxide
CBGA
— Ceramic Ball Grid Array
ENEPIG
— Electroless Nickel Electroless Palladium Immersion Gold
MCAE
— Mechanical Computer-Aided Engineering
ICAM
— integrated computer-aided manufacturing
MLB
— Multilayer Board
FSCM
— Federal Stock Code for Manufacturers
PIP
— Pin-In-Paste Technology
CFM
— Continuous Flow Manufacturing
QTA
— Quick Turn Around
MEK
— Methylethyl Ketone
CALS
— Computer-aided Acquisition and Logistic Support
TOP
— Technical And Office Protocol
RTV
— Room Temperature Vulcanizer
VAR
— Value-Added Reseller
DESC
— Defense Electronics Supply Center
AGV
— Automated Guided Vehicle
MELF
— Metal Electrode Face
LGA
— Lang Grid Array
ZIP
— zigzag inline package
PVT
— Production Validation Test
DTP
— Diameter True Position
ECAD
— Electronic Computer-Aided Design
VHF
— Very-High Frequency
PBGA
— Plastic Ball Grid Array
ZAF
— Z-Axis Adhesive Film
CMC
— Copper Moly Copper
RETMA
— Radio Electronics & Television Manufacturers Association
GAAS
— Gallium Arsenide Application Symposium
AA
— Antenna Array
PWA
— Printed Wiring Assembly
SOIC
— Small-Outline Integrated Circuit
SMTA
— Surface Mount Technology Association
NBR
— Nitrile Butadiene-Acrylonitrile Rubber
ISHM
— International Society For Hybrid Microelectronics
COB
— Chip-On-Board
FMEA
— Fault Mode And Effect Analysis
VHDL
— Vhsic Hardware Description Language
AVT
— Accelerated Vesication Test
DMS
— Dynamic Mechanical Spectroscopy
PDES
— Product Data Exchange Specification
AGR
— Annual Average Growth Rate
ODR
— Oscillating Disk Rheometer
PRT
— Planar Resistor Technology
THT
— Through-Hole Technology
QFP
— Quad Flatpack Package
AOI
— Automated Optical Inspection
CMOS
— cargo movement operations system; complimentary metal-oxide semiconductor
GBIB
— General Purpose Interface Bus
GTPBGA
— Glob Top Plastic Ball Grid Array
C3
— Command,Control And Communicate
ISCET
— International Society of Certified Electronics Technicians
DFM
— Design For Manufacture
BDMA
— Benzyldimethylamine
DRM
— Drawing Requirements Manual
ELD
— Electro-Luminescent Diode
LMC
— Least Material Condition
BC
— Buried Capacitance
DCMC
— Defense Contract Management Command
DTS
— Dock to Stock
CVS
— Cyclic Voltammetry Stripping
FPT
— Fine-Pitch Technology
XIP
— Execute In Place
ETPC
— Electrolytic Tough-Pitch Copper
IEDR
— Initial Engineering Design Review
DIP
— Dual-Inline Package
QML
— Qualified Manufacturer's List
CPU
— Capability Performance Upper
CAPP
— Computer-Aided Process Planning
ECL
— Emitter-Coupled Logic
NECQ
— National Electronics Component Qualification System
DATC
— Design Automation Technical Committee (IEEE)
OSP
— Organic Solder Preservative
IEPS
— International Electronic Packaging Society
ZIF
— Zero-Insertion Force
NADCAP
— National Aerospace and Defense Contractors Accreditation Procedures
CAFM
— Computer-Aided Facilities Management
LTCC
— Low Temperature Co-fired Ceramic
TFA
— Tree-Based Floorplanning Algorithm
VME
— Versa-Module Electronic
AIS
— Adhesive Interconnect System
HPGL
— Hewlett Packard Graphic Language
DMSA
— Defense Manufacturers And Suppliers Association
ASPARC
— Ability of Solder Paste to Retain Components
OA
— Organic Acid
ACCU
— Alternating Current Connection Unit
FEM
— Finite-Element Modeling
CSA
— Canadian Standards Agency
ECCB
— Electronic Components Certification Board
VSAG
— Vhdl Standardization and Analysis Group
ILB
— Inner-Lead Bonding
ACA
— Anisotropically Conductive Adhesive
VLSI
— Very-Large Scale Integration
FCC
— Flat-Conductor Cable
MATS
— Material Transport Segment
AA
— Automatic Acknowledge
C4
— Controlled Collapse Component Connection
MCAD
— Mechanical Computer Aided Design
HASL
— Hot Air Solder Leveler
COD
— Consumed Oxygen Demand
DIN
— Deutsches Institute for Normung
HTE
— High Temperature Elongation
NIST
— National Institute For Science And Technology
TO
— Transistor Outline
COT
— Configure To Order
FEA
— Finite-Element Analysis
FCT
— Functional Circuit Test
SPICE
— Simulation Program Integrated Circuit Emphasis
TGA
— Thermo Gravimetric Analysis
CAT
— Computer-Aided Testing
CCAPS
— Circuit Card Assembly And Processing System
TAB
— Tape-Automated Bonding
EMPF
— Electronics Manufacturing Productivity Facility
EMS
— Electrical Manufacturing Services
RA
— Rosin-Activated
SEC
— Solvent Extract Conductivity
SOS
— Silicon-On-Sapphire
CSG
— Constructive Solids Geometry
EPT
— Ethylene-Propylene Terepolymer
STEP
— Standard For Exchange Of Product Model Data
OSHA
— Occupational Safety Hazards Act
VHSIC
— Very-High Speed Integrated Circuits
DAB
— Designated Audit Body
BOT
— Build To Order
MCM
— multichip module
AC
— All Call
ICT
— Inner Circuit Test
CAF
— Cathotic Anionic Filaments
CM
— Contract Manufacturer
MIR
— Moisture Insulation Resistance
IDC
— Insulation-Displacement Connection
R
— Rosin
R&R
— Repeatability and Reproducibility
IGES
— Integrated Graphics Exchange System
LDA
— Logic Design Automation
PEM
— Plastic Electronic Module
ATG
— Automatic Test Generation
TMA
— Thermo Mechanical Analysis
RMA
— Rosin Mildy Activated
JEDEC
— Solid State Technology Association
ICA
— Isotropically Conductive Adhesive
CAR
— Computer-Aided Repair
OFHC
— Oxygen-Free High-Conductivity Copper
PTH
— Plated-Through Hole
RWOH
— Reliability Without Hermeticity
MIBK
— Methyl-Isobutyl Ketone
MLPWB
— Multilayer Printed Wiring Board
EPR
— Ethylene-propylene Resin
SMT
— Surface Mounting Technology
ULSI
— Ultra-Large Scale Integration
EDM
— Electro-Discharge Machining
PHIGS
— Programmer's Hierarchical Interface Graphics Standard
DIM
— Data-Information Record
CIM
— computer-integrated manufacturing
BTAB
— Bumped Tape-Automated Bonding
NMR
— Normal-Mode Rejection
PP
— Process Performance
ACC
— Advanced Concept Construction Active Control Channel
CPL
— Capability Performance, Lower
CP
— Capability Performance
ITT
— Inter-Test Time
CEPM
— Certified Ems Program Managers
PT
— Positional tolerance
WSI
— Wafer-Scale Integration
DOS
— Disc Operating System
IECQ
— International Electronic Component Qualification System
RFI
— Radio-Frequency Interference
RTS
— Ramp To Spike
SBU
— Sequential Buildup
DS
— Double-Sided
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