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>> Industry Abbreviations
Look through 366 acronyms and abbreviations related to Industry:
LAN
— Local Area Network
URL
— Universal Resource Locator
PID
— Photo-Imageable Dielectric
OEM
— Original Equipment Manufacturer (usually in reference to car parts)
ROM
— Read-Only Memory
FTP
— File Transfer Protocol
PPM
— parts per million
ANSI
— American National Standards Institute, Inc.
EPA
— Environmental Protection Agency (US)
CPU
— Central Processing Unit
IP
— Internet Protocol
ANOVA
— Analysis of Variance (statistics)
AC
— Alternating Current
ISO
— International Organization for Standardization
LED
— Light-Emitting Diode
ROM
— Rough Order of Magnitude
RFP
— Request For Proposal
CRT
— Cathode Ray Tube (type of TV)
MTBF
— Mean Time Before Failure
ASCII
— American National Standard Code for Information Interchange
TQM
— Total Quality Management
EDI
— Electronic Data Interchange
ASTM
— American Society for Testing and Materials (Philadelphia, Pennsylvania)
LCD
— Liquid Crystal Display
RPM
— Revolutions Per Minute, (Rotations Per Minute)
MSDS
— Material Safety Data Sheets
FET
— Field Effect Transistor
HTTP
— Hypertext Transfer Protocol
ASME
— American Society of Mechanical Engineers
DOD
— United States Department of Defense
WWW
— World Wide Web
ECR
— Engineering Change Request
PCB
— printed circuit board
RAM
— random-access memory
BT
— Bismaleimide Triazine
P&IA
— Packaging And Interconnecting Assembly
AGC
— Automatic Gain Control
CAE
— Computer-Aided Engineering
SMOBC
— Solder Mask Over Bare Copper
P&IS
— Packaging And Interconnecting Structure
PC
— Personal computer (host)
RSS
— Ramp Soak Spike
FAA
— Federal Aviation Administration
WYSIWYG
— What You See Is What You Get (pronounced Wizzy-wig. See Entry For Derived Acronyms)
DSC
— Differential Scanning Calorimetry
MAP
— Manufacturing Automation Protocol
MTTR
— Mean Time To Repair
SQL
— Structured Query Language
FFT
— Fast Fourier Transform
ENIPIG
— Electroless Nickel Immersion Palladium Immersion Gold
WIP
— Work in Process
RPM
— Resale Price Maintenance. The UK Net Book Agreement, as was. Means by which retail prices are controlled by primary suppliers. (Alternatively, Revolutions Per Minute, as in engine speed and 78, 33 and 45 records. In years to come how many people will know
ECO
— Engineering Change Order
ECN
— Engineering Change Notice
CFM
— Cubic Feet per Minute
BOM
— Bill of Material
DBMS
— Database Management System
NPI
— New Product Introduction
PSI
— Pounds Per Square Inch (Static Pressure)
ECC
— Error Correction Code (Error Checking And Correction)
FCC
— Federal Communications Commission (US)
DC
— Direct Current
DLA
— U.S. Defense Logistics Agency
AQL
— Acceptable Quality Level
BOD
— Biochemical Oxygen Demand
CRC
— Contrôle de Redondance Cyclique (French: Cyclic Redundancy Check)
NC
— Numerical Control
IC
— Integrated Circuit
NEMA
— National Electric Manufacturer's Association
IR
— Infrared
T&C
— Terms & Conditions
MMIC
— Monolithic Microwave Integrated Circuit
I/O
— Input/Output
RFS
— Regardless of Feature Size
TTL
— Transistor-Transistor Logic
AWG
— American Wire Gauge
SAE
— Society of Automotive Engineers
MAC
— Media Access Control
PBX
— Private Branch eXchange (company phone system)
MRP II
— manufacturing resource planning
PVC
— Polyvinyl Chloride
DMA
— direct memory access (computer term)
DOE
— Design Of Experiment
RMS
— root mean square (preferred over "RMS")
ABS
— Acrylonitrile, Butadiene, and Styrene
IEEE
— Institute of Electrical and Electronic Engineers, Inc.
NBS
— National Bureau of Standards (US)
FC-PBGA
— Flip Chip Platic Ball Grid Array
EMP
— Electromagnetic Pulse
RFQ
— Request For Quote
ESD
— Electrostatic Discharge
EMC
— Electromagnetic Compatibility
AEC
— Architecture, Engineering, Construction
CNC
— Computer Numerical Control
SPC
— Statistical Process Control. Forerunning quality theory from the 1960s to TQC and TQM.
OSI
— Open Systems Interconnection (iso Standard)
DSP
— Digital Signal Processor
NSA
— National Security Agency
CAD
— Computer-Aided Design
PCMCIA
— Personal Computer Memory Card International Association
IEC
— International Electrotechnical Commission
SQC
— Statistical Quality Control
ASQ
— Alpha System Qualification
SFM
— Surface Feet per Minute
PLD
— Programmable Logic Device
C&E
— Cause and Effect
PDL
— Page Description Language
ATR
— Air Transport Rack
VOC
— Volatile Organic Compounds (air pollution)
BITE
— Built-In Test Equipment
MSI
— Medium-Scale Integration
CAGE
— Commercial and Government Entity
PLCC
— Plastic Leaded Chip Carrier (electronics)
QPL
— qualified products list
UBM
— Under Bump Metallization
MOS
— Model Output Statistics
CTE
— Coefficient of Thermal Expansion
NDT
— Nondestructive Test
NASA
— National Aeronautics and Space Administration (US)
DRC
— Design Rule Check
PGA
— Pin Grid Array
FC-CBGA
— Flip Chip Ceramic Ball Grid Array
ARINC
— Aeronautical Radio Incorporated
CSP
— Chip Scale Package
JIT
— Just-In-Time (inventory management)
BGA
— Ball Grid Array [electronic Packaging]
ENIG
— Electroless Nickel Immersion Gold
MMC
— Maximum Material Condition
MDA
— Methylenedianiline
TIFF
— Tag Image File Format
FPGA
— Field-Programmable Gate Array
PTFE
— Polytetrafluoroethylene
PPS
— Polyphenylene Sulfide
TCR
— Temperature Coefficient of Resistance
DVM
— Digital Voltmeter
OLB
— Outer-Lead Bonding
DCMA
— Defense Contract Management Agency
RISC
— Reduced Instruction Set Computing
LSI
— Large Scale Integration -> VLSI
EIA
— Electronics Industry Association (Adelaide, South Australia, Australia)
UPH
— Unit Per Hour
CAM
— Computer-Aided Manufacturing
AOQ
— Average Outgoing Quality
LBA
— Logical Block Addresses
TDR
— Time-Domain Reflectometry
SERA
— Sequential Electrochemical Reduction Analysis
EDO
— Extended Data Output
TP
— True Position
CDA
— Copper Development Association Inc.
MRP
— Material Requirement Planning
CPLD
— Complex Programmable Logic Device
PCA
— Printed Circuit Assembly
SSI
— Small-Scale Integration
DCAS
— Defense Contract Administration Services
ENEPIG
— Electroless Nickel Electroless Palladium Immersion Gold
CITIS
— Contractor Integrated Technical Information Service
SEM
— Scanning Electron Microscopes
KGB
— Known Good Board
MITI
— Ministry of International Trade and Industry
CASE
— Computer-Aided Software Engineering
EDA
— Electronic Design Automation
ILB
— Inner-Lead Bonding
IPM
— Inches Per Minute
EDIF
— Electronic Design Interchange Format
UHF
— Ultrahigh Frequency
CALS
— Computer-aided Acquisition and Logistic Support
PIP
— Pin-In-Paste Technology
KGD
— Known Good Die
DXF
— Data Exchange Format
TOP
— Technical And Office Protocol
TFE
— Tetrafluoroethylene
TG
— Glass Transition Temperature
CISC
— Complex Instruction Set Computing
DESC
— Defense Electronics Supply Center
ESI
— Early Supplier Involvement
RTV
— Room Temperature Vulcanizer
LRU
— Lowest Replaceable Unit
PVT
— Production Validation Test
FEP
— fluorinated ethylene-propylene
LIF
— Low Insertion Force
ICAM
— integrated computer-aided manufacturing
VAR
— Value-Added Reseller
SMEMA
— Surface Mount Equipment Manufacturers Association
MEK
— Methylethyl Ketone
PPO
— PolyPhenylene Oxide
CET
— Certified Electronic Technician
LCCC
— Leadless Ceramic Chip Carrier
ESR
— Equivalent Series Resistance
MCAE
— Mechanical Computer-Aided Engineering
APT
— Automatically Programmed Tools
MLB
— Multilayer Board
DTS
— Dock to Stock
MAC
— Maximum Allowable Concentration
VHF
— Very-High Frequency
CAT
— Computer-Aided Testing
SPICE
— Simulation Program Integrated Circuit Emphasis
AGV
— Automated Guided Vehicle
EMS
— Electrical Manufacturing Services
TCE
— Thermal Coefficient of Expansion
GMA
— Gas Metal Arc
CAPP
— Computer-Aided Process Planning
GTA
— Gas Tungsten Arc
SIR
— Surface Insulation Resistance
LPISM
— Liquid Photo-Imageable Solder Mask
ZAF
— Z-Axis Adhesive Film
CBGA
— Ceramic Ball Grid Array
DNC
— Distributed Numerical Control
CFM
— Continuous Flow Manufacturing
EIS
— Engineering Information System
FAR
— Failure Analysis Report
XIP
— Execute In Place
DK
— Dielectric Constant
PB
— Printed Board
PBGA
— Plastic Ball Grid Array
CMC
— Copper Moly Copper
SMD
— Surface Mount Device
MA
— Mechanical Advantage
ECAD
— Electronic Computer-Aided Design
DOD
— Dissolved Oxygen Demand
FSCM
— Federal Stock Code for Manufacturers
AXI
— Automated X-Ray Inspection
SOIC
— Small-Outline Integrated Circuit
ZIP
— zigzag inline package
QTA
— Quick Turn Around
CCAPS
— Circuit Card Assembly And Processing System
CVS
— Cyclic Voltammetry Stripping
GAAS
— Gallium Arsenide Application Symposium
ED
— Electrodeposited
ACCU
— Alternating Current Connection Unit
PWA
— Printed Wiring Assembly
RETMA
— Radio Electronics & Television Manufacturers Association
EMF
— Electro-Motive Force
NBR
— Nitrile Butadiene-Acrylonitrile Rubber
AA
— Antenna Array
AVT
— Accelerated Vesication Test
ETPC
— Electrolytic Tough-Pitch Copper
CAFM
— Computer-Aided Facilities Management
THT
— Through-Hole Technology
AGR
— Annual Average Growth Rate
BDMA
— Benzyldimethylamine
PDES
— Product Data Exchange Specification
SMTA
— Surface Mount Technology Association
DCMC
— Defense Contract Management Command
LGA
— Lang Grid Array
SEM
— standard electronic module
SIP
— Single Inline Package
ACA
— Anisotropically Conductive Adhesive
ASPARC
— Ability of Solder Paste to Retain Components
CMOS
— cargo movement operations system; complimentary metal-oxide semiconductor
AIS
— Adhesive Interconnect System
MELF
— Metal Electrode Face
VHDL
— Vhsic Hardware Description Language
DRM
— Drawing Requirements Manual
GTPBGA
— Glob Top Plastic Ball Grid Array
QML
— Qualified Manufacturer's List
FMEA
— Fault Mode And Effect Analysis
QFP
— Quad Flatpack Package
CPU
— Capability Performance Upper
ZIF
— Zero-Insertion Force
VLSI
— Very-Large Scale Integration
DMS
— Dynamic Mechanical Spectroscopy
R&R
— Repeatability and Reproducibility
ISHM
— International Society For Hybrid Microelectronics
EMPF
— Electronics Manufacturing Productivity Facility
HPGL
— Hewlett Packard Graphic Language
IEPS
— International Electronic Packaging Society
ATG
— Automatic Test Generation
AC
— All Call
DIP
— Dual-Inline Package
AOI
— Automated Optical Inspection
COD
— Consumed Oxygen Demand
IEDR
— Initial Engineering Design Review
ODR
— Oscillating Disk Rheometer
LTCC
— Low Temperature Co-fired Ceramic
DTP
— Diameter True Position
DATC
— Design Automation Technical Committee (IEEE)
NIST
— National Institute For Science And Technology
AA
— Automatic Acknowledge
NADCAP
— National Aerospace and Defense Contractors Accreditation Procedures
C4
— Controlled Collapse Component Connection
COB
— Chip-On-Board
OFHC
— Oxygen-Free High-Conductivity Copper
FPT
— Fine-Pitch Technology
VME
— Versa-Module Electronic
LMC
— Least Material Condition
ISCET
— International Society of Certified Electronics Technicians
MCAD
— Mechanical Computer Aided Design
ECCB
— Electronic Components Certification Board
GBIB
— General Purpose Interface Bus
C3
— Command,Control And Communicate
NECQ
— National Electronics Component Qualification System
WSI
— Wafer-Scale Integration
ECL
— Emitter-Coupled Logic
HTE
— High Temperature Elongation
VHSIC
— Very-High Speed Integrated Circuits
DAB
— Designated Audit Body
ITT
— Inter-Test Time
CAR
— Computer-Aided Repair
DFM
— Design For Manufacture
DMSA
— Defense Manufacturers And Suppliers Association
OA
— Organic Acid
FEM
— Finite-Element Modeling
ULSI
— Ultra-Large Scale Integration
PHIGS
— Programmer's Hierarchical Interface Graphics Standard
BC
— Buried Capacitance
RWOH
— Reliability Without Hermeticity
SMT
— Surface Mounting Technology
TAB
— Tape-Automated Bonding
VSAG
— Vhdl Standardization and Analysis Group
CSA
— Canadian Standards Agency
ELD
— Electro-Luminescent Diode
CM
— Contract Manufacturer
BTAB
— Bumped Tape-Automated Bonding
TO
— Transistor Outline
MLPWB
— Multilayer Printed Wiring Board
IGES
— Integrated Graphics Exchange System
RFI
— Radio-Frequency Interference
RMA
— Rosin Mildy Activated
CIM
— computer-integrated manufacturing
TFA
— Tree-Based Floorplanning Algorithm
TGA
— Thermo Gravimetric Analysis
TMA
— Thermo Mechanical Analysis
PTH
— Plated-Through Hole
HASL
— Hot Air Solder Leveler
CEPM
— Certified Ems Program Managers
PP
— Process Performance
SOS
— Silicon-On-Sapphire
STEP
— Standard For Exchange Of Product Model Data
OSP
— Organic Solder Preservative
BOT
— Build To Order
FEA
— Finite-Element Analysis
FCT
— Functional Circuit Test
MIBK
— Methyl-Isobutyl Ketone
LDA
— Logic Design Automation
NMR
— Normal-Mode Rejection
DIM
— Data-Information Record
JEDEC
— Solid State Technology Association
COT
— Configure To Order
CP
— Capability Performance
FCC
— Flat-Conductor Cable
PRT
— Planar Resistor Technology
ACC
— Advanced Concept Construction Active Control Channel
CAF
— Cathotic Anionic Filaments
RA
— Rosin-Activated
DIN
— Deutsches Institute for Normung
IECQ
— International Electronic Component Qualification System
DOS
— Disc Operating System
CPL
— Capability Performance, Lower
EDM
— Electro-Discharge Machining
R
— Rosin
IDC
— Insulation-Displacement Connection
MATS
— Material Transport Segment
MIR
— Moisture Insulation Resistance
DS
— Double-Sided
MCM
— multichip module
ICA
— Isotropically Conductive Adhesive
EPT
— Ethylene-Propylene Terepolymer
OSHA
— Occupational Safety Hazards Act
RTS
— Ramp To Spike
ICT
— Inner Circuit Test
EPR
— Ethylene-propylene Resin
CSG
— Constructive Solids Geometry
SBU
— Sequential Buildup
PT
— Positional tolerance
PEM
— Plastic Electronic Module
SEC
— Solvent Extract Conductivity
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