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>> Industry Abbreviations
Look through 366 acronyms and abbreviations related to Industry:
LAN
— Local Area Network
ROM
— Read-Only Memory
ANOVA
— Analysis of Variance (statistics)
FTP
— File Transfer Protocol
RSS
— Ramp Soak Spike
ANSI
— American National Standards Institute, Inc.
CPU
— Central Processing Unit
LED
— Light-Emitting Diode
BT
— Bismaleimide Triazine
OEM
— Original Equipment Manufacturer (usually in reference to car parts)
DSC
— Differential Scanning Calorimetry
IP
— Internet Protocol
P&IA
— Packaging And Interconnecting Assembly
ISO
— International Organization for Standardization
LCD
— Liquid Crystal Display
EDI
— Electronic Data Interchange
PID
— Photo-Imageable Dielectric
WWW
— World Wide Web
PPM
— parts per million
FET
— Field Effect Transistor
AC
— Alternating Current
ROM
— Rough Order of Magnitude
P&IS
— Packaging And Interconnecting Structure
TQM
— Total Quality Management
RFP
— Request For Proposal
MSDS
— Material Safety Data Sheets
ASTM
— American Society for Testing and Materials (Philadelphia, Pennsylvania)
URL
— Universal Resource Locator
ASME
— American Society of Mechanical Engineers
DBMS
— Database Management System
SMOBC
— Solder Mask Over Bare Copper
HTTP
— Hypertext Transfer Protocol
MTBF
— Mean Time Before Failure
ASCII
— American National Standard Code for Information Interchange
PCB
— printed circuit board
EPA
— Environmental Protection Agency (US)
BOD
— Biochemical Oxygen Demand
ABS
— Acrylonitrile, Butadiene, and Styrene
FAA
— Federal Aviation Administration
CAE
— Computer-Aided Engineering
RAM
— random-access memory
MMIC
— Monolithic Microwave Integrated Circuit
RFS
— Regardless of Feature Size
CRT
— Cathode Ray Tube (type of TV)
ENIPIG
— Electroless Nickel Immersion Palladium Immersion Gold
CFM
— Cubic Feet per Minute
EMP
— Electromagnetic Pulse
RPM
— Revolutions Per Minute, (Rotations Per Minute)
DOD
— United States Department of Defense
ECR
— Engineering Change Request
NC
— Numerical Control
NPI
— New Product Introduction
ATR
— Air Transport Rack
TTL
— Transistor-Transistor Logic
DC
— Direct Current
FFT
— Fast Fourier Transform
PVC
— Polyvinyl Chloride
MTTR
— Mean Time To Repair
IC
— Integrated Circuit
I/O
— Input/Output
ECO
— Engineering Change Order
AGC
— Automatic Gain Control
PC
— Personal computer (host)
PDL
— Page Description Language
RFQ
— Request For Quote
PLD
— Programmable Logic Device
SQL
— Structured Query Language
BOM
— Bill of Material
CRC
— Contrôle de Redondance Cyclique (French: Cyclic Redundancy Check)
OSI
— Open Systems Interconnection (iso Standard)
MAP
— Manufacturing Automation Protocol
AQL
— Acceptable Quality Level
NSA
— National Security Agency
WIP
— Work in Process
MOS
— Model Output Statistics
RPM
— Resale Price Maintenance. The UK Net Book Agreement, as was. Means by which retail prices are controlled by primary suppliers. (Alternatively, Revolutions Per Minute, as in engine speed and 78, 33 and 45 records. In years to come how many people will know
ECN
— Engineering Change Notice
AEC
— Architecture, Engineering, Construction
FC-PBGA
— Flip Chip Platic Ball Grid Array
NEMA
— National Electric Manufacturer's Association
PSI
— Pounds Per Square Inch (Static Pressure)
WYSIWYG
— What You See Is What You Get (pronounced Wizzy-wig. See Entry For Derived Acronyms)
PGA
— Pin Grid Array
DMA
— direct memory access (computer term)
ECC
— Error Correction Code (Error Checking And Correction)
ESD
— Electrostatic Discharge
CTE
— Coefficient of Thermal Expansion
FCC
— Federal Communications Commission (US)
SAE
— Society of Automotive Engineers
DLA
— U.S. Defense Logistics Agency
DOE
— Design Of Experiment
AWG
— American Wire Gauge
CSP
— Chip Scale Package
BITE
— Built-In Test Equipment
PBX
— Private Branch eXchange (company phone system)
IR
— Infrared
IEEE
— Institute of Electrical and Electronic Engineers, Inc.
NBS
— National Bureau of Standards (US)
CNC
— Computer Numerical Control
MAC
— Media Access Control
IEC
— International Electrotechnical Commission
SFM
— Surface Feet per Minute
PLCC
— Plastic Leaded Chip Carrier (electronics)
DSP
— Digital Signal Processor
RMS
— root mean square (preferred over "RMS")
ASQ
— Alpha System Qualification
EMC
— Electromagnetic Compatibility
T&C
— Terms & Conditions
SPC
— Statistical Process Control. Forerunning quality theory from the 1960s to TQC and TQM.
MSI
— Medium-Scale Integration
BGA
— Ball Grid Array [electronic Packaging]
SQC
— Statistical Quality Control
PCMCIA
— Personal Computer Memory Card International Association
ARINC
— Aeronautical Radio Incorporated
PPS
— Polyphenylene Sulfide
C&E
— Cause and Effect
MRP II
— manufacturing resource planning
NASA
— National Aeronautics and Space Administration (US)
NDT
— Nondestructive Test
MMC
— Maximum Material Condition
DRC
— Design Rule Check
CAD
— Computer-Aided Design
QPL
— qualified products list
TCR
— Temperature Coefficient of Resistance
CAGE
— Commercial and Government Entity
VOC
— Volatile Organic Compounds (air pollution)
FPGA
— Field-Programmable Gate Array
JIT
— Just-In-Time (inventory management)
TFE
— Tetrafluoroethylene
MDA
— Methylenedianiline
LRU
— Lowest Replaceable Unit
CDA
— Copper Development Association Inc.
FC-CBGA
— Flip Chip Ceramic Ball Grid Array
RISC
— Reduced Instruction Set Computing
DVM
— Digital Voltmeter
LSI
— Large Scale Integration -> VLSI
OLB
— Outer-Lead Bonding
LBA
— Logical Block Addresses
TP
— True Position
PTFE
— Polytetrafluoroethylene
PCA
— Printed Circuit Assembly
ENIG
— Electroless Nickel Immersion Gold
TIFF
— Tag Image File Format
EDO
— Extended Data Output
IPM
— Inches Per Minute
UBM
— Under Bump Metallization
DCMA
— Defense Contract Management Agency
UPH
— Unit Per Hour
AOQ
— Average Outgoing Quality
EIA
— Electronics Industry Association (Adelaide, South Australia, Australia)
MRP
— Material Requirement Planning
ESI
— Early Supplier Involvement
DXF
— Data Exchange Format
TCE
— Thermal Coefficient of Expansion
MITI
— Ministry of International Trade and Industry
ESR
— Equivalent Series Resistance
SIR
— Surface Insulation Resistance
CAM
— Computer-Aided Manufacturing
SMEMA
— Surface Mount Equipment Manufacturers Association
KGB
— Known Good Board
TDR
— Time-Domain Reflectometry
TG
— Glass Transition Temperature
LCCC
— Leadless Ceramic Chip Carrier
SERA
— Sequential Electrochemical Reduction Analysis
CASE
— Computer-Aided Software Engineering
LPISM
— Liquid Photo-Imageable Solder Mask
CPLD
— Complex Programmable Logic Device
SEM
— Scanning Electron Microscopes
MAC
— Maximum Allowable Concentration
GTA
— Gas Tungsten Arc
GMA
— Gas Metal Arc
UHF
— Ultrahigh Frequency
CITIS
— Contractor Integrated Technical Information Service
KGD
— Known Good Die
MA
— Mechanical Advantage
EDA
— Electronic Design Automation
CISC
— Complex Instruction Set Computing
DCAS
— Defense Contract Administration Services
EDIF
— Electronic Design Interchange Format
ENEPIG
— Electroless Nickel Electroless Palladium Immersion Gold
CET
— Certified Electronic Technician
FAR
— Failure Analysis Report
FEP
— fluorinated ethylene-propylene
SMD
— Surface Mount Device
DK
— Dielectric Constant
LIF
— Low Insertion Force
TOP
— Technical And Office Protocol
SSI
— Small-Scale Integration
VAR
— Value-Added Reseller
RTV
— Room Temperature Vulcanizer
APT
— Automatically Programmed Tools
PPO
— PolyPhenylene Oxide
MEK
— Methylethyl Ketone
PB
— Printed Board
CBGA
— Ceramic Ball Grid Array
PVT
— Production Validation Test
DESC
— Defense Electronics Supply Center
MCAE
— Mechanical Computer-Aided Engineering
EMF
— Electro-Motive Force
PIP
— Pin-In-Paste Technology
CALS
— Computer-aided Acquisition and Logistic Support
ED
— Electrodeposited
ICAM
— integrated computer-aided manufacturing
EIS
— Engineering Information System
FSCM
— Federal Stock Code for Manufacturers
CAT
— Computer-Aided Testing
DOD
— Dissolved Oxygen Demand
ILB
— Inner-Lead Bonding
MLB
— Multilayer Board
SEM
— standard electronic module
DNC
— Distributed Numerical Control
AXI
— Automated X-Ray Inspection
CFM
— Continuous Flow Manufacturing
ZAF
— Z-Axis Adhesive Film
ZIP
— zigzag inline package
CMC
— Copper Moly Copper
PBGA
— Plastic Ball Grid Array
SIP
— Single Inline Package
VHF
— Very-High Frequency
QTA
— Quick Turn Around
AGV
— Automated Guided Vehicle
CAFM
— Computer-Aided Facilities Management
RETMA
— Radio Electronics & Television Manufacturers Association
DTP
— Diameter True Position
ACCU
— Alternating Current Connection Unit
AA
— Antenna Array
PWA
— Printed Wiring Assembly
ECAD
— Electronic Computer-Aided Design
SOIC
— Small-Outline Integrated Circuit
MELF
— Metal Electrode Face
PDES
— Product Data Exchange Specification
GAAS
— Gallium Arsenide Application Symposium
DIP
— Dual-Inline Package
QFP
— Quad Flatpack Package
LGA
— Lang Grid Array
R&R
— Repeatability and Reproducibility
ACA
— Anisotropically Conductive Adhesive
XIP
— Execute In Place
SMTA
— Surface Mount Technology Association
AIS
— Adhesive Interconnect System
DCMC
— Defense Contract Management Command
AGR
— Annual Average Growth Rate
VHDL
— Vhsic Hardware Description Language
NBR
— Nitrile Butadiene-Acrylonitrile Rubber
AVT
— Accelerated Vesication Test
GTPBGA
— Glob Top Plastic Ball Grid Array
IEDR
— Initial Engineering Design Review
THT
— Through-Hole Technology
ZIF
— Zero-Insertion Force
DTS
— Dock to Stock
CVS
— Cyclic Voltammetry Stripping
BDMA
— Benzyldimethylamine
FMEA
— Fault Mode And Effect Analysis
DMS
— Dynamic Mechanical Spectroscopy
DRM
— Drawing Requirements Manual
PRT
— Planar Resistor Technology
EMPF
— Electronics Manufacturing Productivity Facility
HPGL
— Hewlett Packard Graphic Language
OFHC
— Oxygen-Free High-Conductivity Copper
BC
— Buried Capacitance
ASPARC
— Ability of Solder Paste to Retain Components
ISHM
— International Society For Hybrid Microelectronics
CMOS
— cargo movement operations system; complimentary metal-oxide semiconductor
IEPS
— International Electronic Packaging Society
QML
— Qualified Manufacturer's List
COB
— Chip-On-Board
DMSA
— Defense Manufacturers And Suppliers Association
ISCET
— International Society of Certified Electronics Technicians
ETPC
— Electrolytic Tough-Pitch Copper
DATC
— Design Automation Technical Committee (IEEE)
GBIB
— General Purpose Interface Bus
VHSIC
— Very-High Speed Integrated Circuits
LMC
— Least Material Condition
ECCB
— Electronic Components Certification Board
ODR
— Oscillating Disk Rheometer
SPICE
— Simulation Program Integrated Circuit Emphasis
CAPP
— Computer-Aided Process Planning
ELD
— Electro-Luminescent Diode
DFM
— Design For Manufacture
CPU
— Capability Performance Upper
AOI
— Automated Optical Inspection
FPT
— Fine-Pitch Technology
DAB
— Designated Audit Body
ITT
— Inter-Test Time
VLSI
— Very-Large Scale Integration
C3
— Command,Control And Communicate
RA
— Rosin-Activated
TO
— Transistor Outline
C4
— Controlled Collapse Component Connection
OA
— Organic Acid
FEM
— Finite-Element Modeling
HASL
— Hot Air Solder Leveler
STEP
— Standard For Exchange Of Product Model Data
ATG
— Automatic Test Generation
NECQ
— National Electronics Component Qualification System
OSP
— Organic Solder Preservative
TFA
— Tree-Based Floorplanning Algorithm
RWOH
— Reliability Without Hermeticity
AA
— Automatic Acknowledge
CSA
— Canadian Standards Agency
ECL
— Emitter-Coupled Logic
RFI
— Radio-Frequency Interference
TGA
— Thermo Gravimetric Analysis
TMA
— Thermo Mechanical Analysis
NIST
— National Institute For Science And Technology
VME
— Versa-Module Electronic
FEA
— Finite-Element Analysis
VSAG
— Vhdl Standardization and Analysis Group
FCC
— Flat-Conductor Cable
LTCC
— Low Temperature Co-fired Ceramic
COT
— Configure To Order
MCAD
— Mechanical Computer Aided Design
NADCAP
— National Aerospace and Defense Contractors Accreditation Procedures
EMS
— Electrical Manufacturing Services
FCT
— Functional Circuit Test
COD
— Consumed Oxygen Demand
IGES
— Integrated Graphics Exchange System
PHIGS
— Programmer's Hierarchical Interface Graphics Standard
RMA
— Rosin Mildy Activated
TAB
— Tape-Automated Bonding
CAR
— Computer-Aided Repair
PTH
— Plated-Through Hole
MLPWB
— Multilayer Printed Wiring Board
R
— Rosin
SMT
— Surface Mounting Technology
DIN
— Deutsches Institute for Normung
SOS
— Silicon-On-Sapphire
PT
— Positional tolerance
WSI
— Wafer-Scale Integration
CAF
— Cathotic Anionic Filaments
CP
— Capability Performance
CCAPS
— Circuit Card Assembly And Processing System
BTAB
— Bumped Tape-Automated Bonding
MATS
— Material Transport Segment
DOS
— Disc Operating System
SBU
— Sequential Buildup
EPT
— Ethylene-Propylene Terepolymer
CEPM
— Certified Ems Program Managers
PP
— Process Performance
AC
— All Call
MIBK
— Methyl-Isobutyl Ketone
IDC
— Insulation-Displacement Connection
CPL
— Capability Performance, Lower
ULSI
— Ultra-Large Scale Integration
SEC
— Solvent Extract Conductivity
EDM
— Electro-Discharge Machining
HTE
— High Temperature Elongation
BOT
— Build To Order
MCM
— multichip module
JEDEC
— Solid State Technology Association
NMR
— Normal-Mode Rejection
ACC
— Advanced Concept Construction Active Control Channel
LDA
— Logic Design Automation
OSHA
— Occupational Safety Hazards Act
CIM
— computer-integrated manufacturing
ICA
— Isotropically Conductive Adhesive
ICT
— Inner Circuit Test
CM
— Contract Manufacturer
MIR
— Moisture Insulation Resistance
DS
— Double-Sided
EPR
— Ethylene-propylene Resin
IECQ
— International Electronic Component Qualification System
CSG
— Constructive Solids Geometry
PEM
— Plastic Electronic Module
RTS
— Ramp To Spike
DIM
— Data-Information Record
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