toggle menu
Categories
Locations, Regional & international
Business & Finance
Common / Miscellaneous / Community
Medical
Scientific & Educational
Computing & IT
Internet Slang, SMS, Texting & Chat
Governmental & Military
Submit new
Desktop Version
Top Abbreviations
Acronym > Term
Word in meaning
Term > Acronym
Home
/
Common / Miscellaneous / Community
/
Industry
Common / Miscellaneous / Community
>> Industry Abbreviations
Look through 366 acronyms and abbreviations related to Industry:
LAN
— Local Area Network
ROM
— Read-Only Memory
ANOVA
— Analysis of Variance (statistics)
FTP
— File Transfer Protocol
RSS
— Ramp Soak Spike
ANSI
— American National Standards Institute, Inc.
LED
— Light-Emitting Diode
CPU
— Central Processing Unit
BT
— Bismaleimide Triazine
OEM
— Original Equipment Manufacturer (usually in reference to car parts)
PPM
— parts per million
IP
— Internet Protocol
P&IA
— Packaging And Interconnecting Assembly
ISO
— International Organization for Standardization
ROM
— Rough Order of Magnitude
DSC
— Differential Scanning Calorimetry
PID
— Photo-Imageable Dielectric
EDI
— Electronic Data Interchange
LCD
— Liquid Crystal Display
WWW
— World Wide Web
FET
— Field Effect Transistor
AC
— Alternating Current
P&IS
— Packaging And Interconnecting Structure
URL
— Universal Resource Locator
RFP
— Request For Proposal
TQM
— Total Quality Management
ASTM
— American Society for Testing and Materials (Philadelphia, Pennsylvania)
MSDS
— Material Safety Data Sheets
SMOBC
— Solder Mask Over Bare Copper
ASME
— American Society of Mechanical Engineers
DBMS
— Database Management System
ASCII
— American National Standard Code for Information Interchange
MTBF
— Mean Time Before Failure
HTTP
— Hypertext Transfer Protocol
EPA
— Environmental Protection Agency (US)
PCB
— printed circuit board
RAM
— random-access memory
CAE
— Computer-Aided Engineering
FAA
— Federal Aviation Administration
BOD
— Biochemical Oxygen Demand
ABS
— Acrylonitrile, Butadiene, and Styrene
MMIC
— Monolithic Microwave Integrated Circuit
CFM
— Cubic Feet per Minute
CRT
— Cathode Ray Tube (type of TV)
RFS
— Regardless of Feature Size
ENIPIG
— Electroless Nickel Immersion Palladium Immersion Gold
NPI
— New Product Introduction
ECR
— Engineering Change Request
DOD
— United States Department of Defense
RPM
— Revolutions Per Minute, (Rotations Per Minute)
EMP
— Electromagnetic Pulse
NC
— Numerical Control
TTL
— Transistor-Transistor Logic
ATR
— Air Transport Rack
DC
— Direct Current
MTTR
— Mean Time To Repair
ECO
— Engineering Change Order
IC
— Integrated Circuit
AGC
— Automatic Gain Control
FFT
— Fast Fourier Transform
PVC
— Polyvinyl Chloride
PC
— Personal computer (host)
I/O
— Input/Output
RFQ
— Request For Quote
OSI
— Open Systems Interconnection (iso Standard)
WIP
— Work in Process
AQL
— Acceptable Quality Level
BOM
— Bill of Material
SQL
— Structured Query Language
MAP
— Manufacturing Automation Protocol
PLD
— Programmable Logic Device
PDL
— Page Description Language
ECN
— Engineering Change Notice
CRC
— Contrôle de Redondance Cyclique (French: Cyclic Redundancy Check)
RPM
— Resale Price Maintenance. The UK Net Book Agreement, as was. Means by which retail prices are controlled by primary suppliers. (Alternatively, Revolutions Per Minute, as in engine speed and 78, 33 and 45 records. In years to come how many people will know
NSA
— National Security Agency
AEC
— Architecture, Engineering, Construction
PSI
— Pounds Per Square Inch (Static Pressure)
MOS
— Model Output Statistics
NEMA
— National Electric Manufacturer's Association
FCC
— Federal Communications Commission (US)
ECC
— Error Correction Code (Error Checking And Correction)
WYSIWYG
— What You See Is What You Get (pronounced Wizzy-wig. See Entry For Derived Acronyms)
FC-PBGA
— Flip Chip Platic Ball Grid Array
PLCC
— Plastic Leaded Chip Carrier (electronics)
ESD
— Electrostatic Discharge
PGA
— Pin Grid Array
DMA
— direct memory access (computer term)
SAE
— Society of Automotive Engineers
DLA
— U.S. Defense Logistics Agency
AWG
— American Wire Gauge
CTE
— Coefficient of Thermal Expansion
DOE
— Design Of Experiment
CSP
— Chip Scale Package
PBX
— Private Branch eXchange (company phone system)
BITE
— Built-In Test Equipment
T&C
— Terms & Conditions
IEEE
— Institute of Electrical and Electronic Engineers, Inc.
IEC
— International Electrotechnical Commission
CNC
— Computer Numerical Control
NBS
— National Bureau of Standards (US)
IR
— Infrared
SFM
— Surface Feet per Minute
MAC
— Media Access Control
RMS
— root mean square (preferred over "RMS")
DSP
— Digital Signal Processor
SPC
— Statistical Process Control. Forerunning quality theory from the 1960s to TQC and TQM.
ASQ
— Alpha System Qualification
EMC
— Electromagnetic Compatibility
MSI
— Medium-Scale Integration
SQC
— Statistical Quality Control
BGA
— Ball Grid Array [electronic Packaging]
MRP II
— manufacturing resource planning
PCMCIA
— Personal Computer Memory Card International Association
ARINC
— Aeronautical Radio Incorporated
VOC
— Volatile Organic Compounds (air pollution)
DRC
— Design Rule Check
PPS
— Polyphenylene Sulfide
C&E
— Cause and Effect
CAD
— Computer-Aided Design
QPL
— qualified products list
NDT
— Nondestructive Test
NASA
— National Aeronautics and Space Administration (US)
CAGE
— Commercial and Government Entity
MMC
— Maximum Material Condition
TCR
— Temperature Coefficient of Resistance
JIT
— Just-In-Time (inventory management)
FPGA
— Field-Programmable Gate Array
MDA
— Methylenedianiline
LRU
— Lowest Replaceable Unit
ENIG
— Electroless Nickel Immersion Gold
TFE
— Tetrafluoroethylene
FC-CBGA
— Flip Chip Ceramic Ball Grid Array
CDA
— Copper Development Association Inc.
RISC
— Reduced Instruction Set Computing
OLB
— Outer-Lead Bonding
LBA
— Logical Block Addresses
UBM
— Under Bump Metallization
LSI
— Large Scale Integration -> VLSI
PTFE
— Polytetrafluoroethylene
DVM
— Digital Voltmeter
TP
— True Position
PCA
— Printed Circuit Assembly
TIFF
— Tag Image File Format
IPM
— Inches Per Minute
DCMA
— Defense Contract Management Agency
EDO
— Extended Data Output
UPH
— Unit Per Hour
EIA
— Electronics Industry Association (Adelaide, South Australia, Australia)
MRP
— Material Requirement Planning
AOQ
— Average Outgoing Quality
ESI
— Early Supplier Involvement
DXF
— Data Exchange Format
MITI
— Ministry of International Trade and Industry
TCE
— Thermal Coefficient of Expansion
SMEMA
— Surface Mount Equipment Manufacturers Association
ESR
— Equivalent Series Resistance
CAM
— Computer-Aided Manufacturing
CPLD
— Complex Programmable Logic Device
SIR
— Surface Insulation Resistance
KGB
— Known Good Board
TDR
— Time-Domain Reflectometry
TG
— Glass Transition Temperature
SERA
— Sequential Electrochemical Reduction Analysis
CASE
— Computer-Aided Software Engineering
LCCC
— Leadless Ceramic Chip Carrier
LPISM
— Liquid Photo-Imageable Solder Mask
GTA
— Gas Tungsten Arc
MAC
— Maximum Allowable Concentration
SEM
— Scanning Electron Microscopes
CITIS
— Contractor Integrated Technical Information Service
GMA
— Gas Metal Arc
ENEPIG
— Electroless Nickel Electroless Palladium Immersion Gold
UHF
— Ultrahigh Frequency
KGD
— Known Good Die
EDA
— Electronic Design Automation
CET
— Certified Electronic Technician
CISC
— Complex Instruction Set Computing
MA
— Mechanical Advantage
EDIF
— Electronic Design Interchange Format
DCAS
— Defense Contract Administration Services
FEP
— fluorinated ethylene-propylene
FAR
— Failure Analysis Report
TOP
— Technical And Office Protocol
SMD
— Surface Mount Device
LIF
— Low Insertion Force
DK
— Dielectric Constant
SSI
— Small-Scale Integration
PVT
— Production Validation Test
VAR
— Value-Added Reseller
RTV
— Room Temperature Vulcanizer
APT
— Automatically Programmed Tools
PPO
— PolyPhenylene Oxide
MEK
— Methylethyl Ketone
PB
— Printed Board
CBGA
— Ceramic Ball Grid Array
DESC
— Defense Electronics Supply Center
CAT
— Computer-Aided Testing
PIP
— Pin-In-Paste Technology
MCAE
— Mechanical Computer-Aided Engineering
ICAM
— integrated computer-aided manufacturing
CALS
— Computer-aided Acquisition and Logistic Support
EMF
— Electro-Motive Force
ED
— Electrodeposited
DNC
— Distributed Numerical Control
FSCM
— Federal Stock Code for Manufacturers
ILB
— Inner-Lead Bonding
EIS
— Engineering Information System
SEM
— standard electronic module
MLB
— Multilayer Board
DOD
— Dissolved Oxygen Demand
ZIP
— zigzag inline package
CFM
— Continuous Flow Manufacturing
AXI
— Automated X-Ray Inspection
ZAF
— Z-Axis Adhesive Film
CMC
— Copper Moly Copper
SIP
— Single Inline Package
PBGA
— Plastic Ball Grid Array
VHF
— Very-High Frequency
CAFM
— Computer-Aided Facilities Management
AGV
— Automated Guided Vehicle
DTS
— Dock to Stock
QTA
— Quick Turn Around
RETMA
— Radio Electronics & Television Manufacturers Association
DTP
— Diameter True Position
AA
— Antenna Array
ACCU
— Alternating Current Connection Unit
MELF
— Metal Electrode Face
PDES
— Product Data Exchange Specification
PWA
— Printed Wiring Assembly
ECAD
— Electronic Computer-Aided Design
SOIC
— Small-Outline Integrated Circuit
GAAS
— Gallium Arsenide Application Symposium
DCMC
— Defense Contract Management Command
LGA
— Lang Grid Array
AVT
— Accelerated Vesication Test
ISHM
— International Society For Hybrid Microelectronics
SMTA
— Surface Mount Technology Association
QFP
— Quad Flatpack Package
DIP
— Dual-Inline Package
R&R
— Repeatability and Reproducibility
NBR
— Nitrile Butadiene-Acrylonitrile Rubber
XIP
— Execute In Place
ACA
— Anisotropically Conductive Adhesive
THT
— Through-Hole Technology
CVS
— Cyclic Voltammetry Stripping
GTPBGA
— Glob Top Plastic Ball Grid Array
IEDR
— Initial Engineering Design Review
AIS
— Adhesive Interconnect System
ZIF
— Zero-Insertion Force
AGR
— Annual Average Growth Rate
VHDL
— Vhsic Hardware Description Language
FMEA
— Fault Mode And Effect Analysis
BDMA
— Benzyldimethylamine
PRT
— Planar Resistor Technology
DMS
— Dynamic Mechanical Spectroscopy
DRM
— Drawing Requirements Manual
EMPF
— Electronics Manufacturing Productivity Facility
ASPARC
— Ability of Solder Paste to Retain Components
QML
— Qualified Manufacturer's List
CMOS
— cargo movement operations system; complimentary metal-oxide semiconductor
VHSIC
— Very-High Speed Integrated Circuits
IEPS
— International Electronic Packaging Society
HPGL
— Hewlett Packard Graphic Language
BC
— Buried Capacitance
COB
— Chip-On-Board
OFHC
— Oxygen-Free High-Conductivity Copper
CAPP
— Computer-Aided Process Planning
ETPC
— Electrolytic Tough-Pitch Copper
DATC
— Design Automation Technical Committee (IEEE)
GBIB
— General Purpose Interface Bus
VLSI
— Very-Large Scale Integration
ISCET
— International Society of Certified Electronics Technicians
DMSA
— Defense Manufacturers And Suppliers Association
ECCB
— Electronic Components Certification Board
ODR
— Oscillating Disk Rheometer
DAB
— Designated Audit Body
ELD
— Electro-Luminescent Diode
LMC
— Least Material Condition
C4
— Controlled Collapse Component Connection
SPICE
— Simulation Program Integrated Circuit Emphasis
ITT
— Inter-Test Time
C3
— Command,Control And Communicate
DFM
— Design For Manufacture
EMS
— Electrical Manufacturing Services
CPU
— Capability Performance Upper
AOI
— Automated Optical Inspection
FPT
— Fine-Pitch Technology
FEA
— Finite-Element Analysis
RA
— Rosin-Activated
OA
— Organic Acid
STEP
— Standard For Exchange Of Product Model Data
TGA
— Thermo Gravimetric Analysis
OSP
— Organic Solder Preservative
NECQ
— National Electronics Component Qualification System
TFA
— Tree-Based Floorplanning Algorithm
TO
— Transistor Outline
AA
— Automatic Acknowledge
FEM
— Finite-Element Modeling
HASL
— Hot Air Solder Leveler
ECL
— Emitter-Coupled Logic
ATG
— Automatic Test Generation
TMA
— Thermo Mechanical Analysis
NIST
— National Institute For Science And Technology
RWOH
— Reliability Without Hermeticity
COT
— Configure To Order
CSA
— Canadian Standards Agency
RFI
— Radio-Frequency Interference
FCC
— Flat-Conductor Cable
LTCC
— Low Temperature Co-fired Ceramic
VME
— Versa-Module Electronic
NADCAP
— National Aerospace and Defense Contractors Accreditation Procedures
CAF
— Cathotic Anionic Filaments
SMT
— Surface Mounting Technology
VSAG
— Vhdl Standardization and Analysis Group
COD
— Consumed Oxygen Demand
RMA
— Rosin Mildy Activated
TAB
— Tape-Automated Bonding
FCT
— Functional Circuit Test
MCAD
— Mechanical Computer Aided Design
PHIGS
— Programmer's Hierarchical Interface Graphics Standard
CCAPS
— Circuit Card Assembly And Processing System
CAR
— Computer-Aided Repair
PTH
— Plated-Through Hole
R
— Rosin
SOS
— Silicon-On-Sapphire
IGES
— Integrated Graphics Exchange System
EPT
— Ethylene-Propylene Terepolymer
MLPWB
— Multilayer Printed Wiring Board
DIN
— Deutsches Institute for Normung
BTAB
— Bumped Tape-Automated Bonding
PT
— Positional tolerance
WSI
— Wafer-Scale Integration
MIBK
— Methyl-Isobutyl Ketone
DOS
— Disc Operating System
CP
— Capability Performance
BOT
— Build To Order
CEPM
— Certified Ems Program Managers
MATS
— Material Transport Segment
SBU
— Sequential Buildup
IDC
— Insulation-Displacement Connection
ULSI
— Ultra-Large Scale Integration
CPL
— Capability Performance, Lower
LDA
— Logic Design Automation
EDM
— Electro-Discharge Machining
HTE
— High Temperature Elongation
CIM
— computer-integrated manufacturing
MCM
— multichip module
PP
— Process Performance
AC
— All Call
NMR
— Normal-Mode Rejection
SEC
— Solvent Extract Conductivity
JEDEC
— Solid State Technology Association
ICA
— Isotropically Conductive Adhesive
ACC
— Advanced Concept Construction Active Control Channel
ICT
— Inner Circuit Test
CM
— Contract Manufacturer
DS
— Double-Sided
OSHA
— Occupational Safety Hazards Act
CSG
— Constructive Solids Geometry
DIM
— Data-Information Record
MIR
— Moisture Insulation Resistance
EPR
— Ethylene-propylene Resin
IECQ
— International Electronic Component Qualification System
PEM
— Plastic Electronic Module
RTS
— Ramp To Spike
Show More Results
7
